ATS-14B-133-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-14B-133-C1-R0-ND

Manufacturer Part#:

ATS-14B-133-C1-R0

Price: $ 5.17
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14B-133-C1-R0 datasheetATS-14B-133-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.65003
30 +: $ 4.39152
50 +: $ 4.13318
100 +: $ 3.87488
250 +: $ 3.61655
500 +: $ 3.35823
1000 +: $ 3.29365
Stock 1000Can Ship Immediately
$ 5.17
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.41°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are an essential component of any system that involves the management and control of heat. ATS-14B-133-C1-R0 is a heat sink designed specifically for the purpose of providing efficient thermal management and cooling. This heat sink is an aluminum plate with high thermal conductivity, designed to be mounted on any device that has an appropriate mounting surface.

The goal of a thermal heat sink is to regulate the temperature of a particular component within a system. Heat sinks work by dissipating heat from the component they are mounted to, allowing the component to remain at an optimal temperature. This heat transfer occurs through process of conduction. Heat is conducted away from the component to the surface of the heat sink and is then dispersed from there. This is how ATS-14B-133-C1-R0 is designed to work.

The ATS-14B-133-C1-R0 heat sink is an ideal solution for applications where the highest thermal performance is required. It has a highly efficient heat transfer design, allowing it to quickly dissipate large amounts of heat. The design of this heat sink allows for installation in either confined or open spaces. Additionally, it is designed to be compatible with a wide range of components, ensuring it can be used in a variety of projects and applications.

The unique design of the ATS-14B-133-C1-R0 heat sink provides a number of advantages for its use in thermal management. It is a highly efficient heat dissipating device, capable of dissipating large amounts of heat quickly. Additionally, it is designed to be highly compatible with components, allowing it to be used in a variety of applications. Additionally, it is designed to be flexible and easy to install, providing a simple and effective solution for applications involving thermal management.

The ATS-14B-133-C1-R0heat sink is an ideal solution for applications that require efficient thermal management and cooling. The efficient design of this heat sink allows it to quickly dissipate large amounts of heat, ensuring components remain at optimal temperatures. Additionally, it is designed to be highly compatible with components, allowing it to be used in a variety of applications. Additionally, its flexible and easy to install design provides a simple and effective solution for applications involving thermal management.

The specific data is subject to PDF, and the above content is for reference

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