
Allicdata Part #: | ATS23487-ND |
Manufacturer Part#: |
ATS-14B-142-C2-R0 |
Price: | $ 3.84 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.49020 |
10 +: | $ 3.40011 |
25 +: | $ 3.30800 |
50 +: | $ 3.12430 |
100 +: | $ 2.94052 |
250 +: | $ 2.75675 |
500 +: | $ 2.66487 |
1000 +: | $ 2.38918 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important consideration for many devices and equipment that provide critical services. Heat sinks are usually used to dissipate heat away from vulnerable components, and are often designed to be highly efficient at doing so. One type of product that is increasingly being utilized in a variety of applications is the ATS-14B-142-C2-R0 heat sink. This device is designed to be used in conjunction with other cooling system components to improve efficiency and reduce overheating.
ATS-14B-142-C2-R0 Heat Sink is a special-purpose thermoelectric cooling component primarily designed for temperatures ranging from -65 to 300°F. It is made of a superior 6AL-4V titanium alloy material and is approximately 3.54-inch long x 0.37-inch thick. The ATS-14B-142-C2-R0 Heat Sink features a split fin design, which is engineered to maximize surface area and generate air flow turbulence, while minimizing air resistance. This design allows for a balanced airflow of both air and heat, resulting in maximum cooling performance.
The ATS-14B-142-C2-R0 heat sink is also designed for easy installation. The housing offers two strain relief features that enable secure mounting of a variety of power sources. Additionally, it includes a built-in thermal cutoff that shuts off power at a certain temperature, preventing any potential damage due to excessive heat build-up. This is an important feature to look for, especially in applications that require a constantly cooled environment.
The ATS-14B-142-C2-R0 heat sink is suitable for a range of applications. Its superior construction and design makes it ideal for use in telecommunications, networking, and other high-precision applications. This product can also be used to expand performance cooling systems, providing additional heat dissipation for demanding applications such as military, automotive, medical, and industrial systems.
The ATS-14B-142-C2-R0 heat sink operates on the principle of cross-flow fluid heat transfer, wherein a heat-producing component on one side of the heat sink is cooled by air passing through cross-flow openings on the opposite side. It is designed to generate sufficient air movement that is low in resistance and turbulence, resulting in efficient heat transfer action. The device also features advanced thermocouple technology, which, when combined with the other design features of this heat sink, gives maximum cooling performance.
Overall, the ATS-14B-142-C2-R0 heat sink is an excellent choice for applications that require cooling solutions. Its superior construction, efficient cooling design, and built-in safety features make this product a valuable asset for applications involving temperature regulation, precision electronics, and heat dissipation. Whether you need to cool delicate components or reduce the temperature of a wide variety of equipment, the ATS-14B-142-C2-R0 heat sink is a versatile and reliable solution for any application requiring thermal management.
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