| Allicdata Part #: | ATS23517-ND |
| Manufacturer Part#: |
ATS-14B-17-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-17-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important considerations in electronics. Heat sinks are used to provide efficient, cost-effective thermal management solutions for electronics and semiconductors. The ATS-14B-17-C2-R0 Heat Sink is one of the most popular solutions in the thermal management industry. This heat sink offers excellent performance and a wide range of applications.
The ATS-14B-17-C2-R0 Heat Sink is constructed of aluminum fins and copper base plates, which allow for maximum heat dissipation. The aluminum fins are designed to optimize airflow and therefore enhance the natural convection process of the heat sink, while the copper baseplates ensure maximum heat distribution and dissipation. The combination of these two materials allows for greater surface area and efficient and effective cooling, as well as excellent heat dissipation.
In addition to these materials, the ATS-14B-17-C2-R0 Heat Sink also features a number of advanced design features. The fins are designed to create a greater surface area for heat dissipation, while the fin shape and spacing creates an efficient airflow path and a lower static pressure. This in turn reduces noise and fan speed, improving system cooling. The heat sink also features a unique heat pipe arrangement, which further enhances the cooling capacity of the unit.
The ATS-14B-17-C2-R0 Heat Sink is designed to provide a wide range of applications. It is particularly well-suited for use in a variety of electronics, including computers, laptops, and industrial control systems. The heat sink can also be used in a wide range of consumer electronics, such as tablets and smartphones, and is also suitable for use in industrial and commercial environments. The high-performance design and advanced design features of the ATS-14B-17-C2-R0 Heat Sink make it an excellent choice for any application where thermal management is essential.
The ATS-14B-17-C2-R0 Heat Sink is designed to be easy to install and use. It can be mounted directly onto the electronics or to a chassis for a secure and reliable connection. The heat sink also features an integrated mounting system that enables easy installation and removal. The heat sink is available in a variety of sizes and configurations, so it is easy to find one that fits your specific application.
The ATS-14B-17-C2-R0 Heat Sink is designed to provide efficient, cost-effective thermal management solutions for electronic and semiconductor applications. It features an advanced design, construction, and a variety of mounting options that make it an ideal choice for a wide range of applications. The ATS-14B-17-C2-R0 Heat Sink offers excellent performance and a wide range of applications, making it a popular choice for thermal management needs.
The specific data is subject to PDF, and the above content is for reference