| Allicdata Part #: | ATS-14B-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-14B-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management heatsinks are an important part of any electronic systems and components. Heat sinks absorb, store, and dissipate heat generated by electronic components. The ATS-14B-173-C1-R0 heatsink features a heat pipe-based cooling system that offers improved cooling performance over traditional heatsink solutions. In this article, we will discuss the application field and the working principle of this heat sink.
The ATS-14B-173-C1-R0 heatsink is designed for use in a wide variety of applications including automotive, consumer electronics, industrial, telecommunications, military and aerospace, and more. It is a cost-effective solution for cooling high-power devices such as CPUs and GPUs. It features a slim and lightweight design that allows for easy assembly and disassembly. It also features a heat pipe-based cooling system, making it highly efficient at dissipating heat away from the segment and into the ambient.
The working principle of the ATS-14B-173-C1-R0 is based on heat pipe technology. Heat pipes are highly efficient heat transfer devices that work by circulating a working fluid through a closed loop. The heat pipe utilizes a wick structure inside the pipe that works to facilitate the movement of the working fluid. As heat is applied on one end of the pipe, the working fluid evaporates and moves through the wick structure to the other end. At the other end, the working fluid condenses and the heat is released to the ambient environment.
The ATS-14B-173-C1-R0 also utilizes a copper base-plate coupled with an array of high-performance heat spreaders. The copper base absorbs the heat from the device and spreads it evenly on the spreaders. The spreaders are designed to disperse the heat quickly and evenly on both sides of the unit, ensuring maximum heat dissipation. As a result, the entire heatsink assembly helps dissipate heat more quickly and efficiently.
The ATS-14B-173-C1-R0 is designed to offer a high level of flexibility in its applications. It is compatible with a range of different mounting schemes allowing it to fit into various mounting profiles and spaces with ease. It also offers adjustable thermal thresholds, allowing users to customize its performance for their specific application. Furthermore, the adjustable spring tension of the heat spreaders helps ensure accurate thermal dissipation across a wide range of temperatures.
Overall, the ATS-14B-173-C1-R0 is an effective and reliable solution for cooling high-power devices. Its combination of heat pipe-based cooling and adjustable heat spreaders offers maximum heat dissipation at a competitive price. This heatsink is suitable for a variety of applications and is a reliable option for keeping electronic components cool and running efficiently.
The specific data is subject to PDF, and the above content is for reference