| Allicdata Part #: | ATS-14B-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-14B-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-14B-197-C1-R0 application field and working principle
The ATS-14B-197-C1-R0 is a thermal heat sink specifically designed for the cooling of electrical and electronic components. This heat sink is composed of a series of alternating layers of aluminum and copper, which each having a specific purpose in cooling the component.
The aluminum layer of the heat sink acts as a heat conductor, transferring heat away from the focal point to the outer edges and away from the electrical component. This layer is the most important factor for successful cooling. The copper layer acts as a thermal mass, absorbing heat and dissipating it as the component is cooled. This helps to keep the temperatures at the focal point low and reduce the risk of a thermal runaway.
The ATS-14B-197-C1-R0 is designed for integrated circuits and other electrically sensitive components. Its efficient heat transfer and uniform heat distribution make it suitable for applications such as DSPs, FPGAs, analog-to-digital converters, and high-speed processors. High-power ICs, which are especially susceptible to thermal runaway, benefit greatly from this heat sink\'s fast thermal conduction capabilities.
The main advantage of this thermal heat sink is its ability to dissipate heat quickly and evenly. The alternating layers of aluminum and copper allow for efficient heat transfer, eliminating pockets of localized hot spots that can cause thermal runaway. The thermal mass of the copper layer helps to keep the temperatures at the focal point low, while the aluminum layer takes heat away from the component quickly. This combination of features makes the ATS-14B-197-C1-R0 an ideal choice for cooling high-power integrated circuits.
Many of the components that rely on this thermal heat sink can be found in a variety of electronics applications. Mobile phones, tablets, and other gadgets that require battery and circuit boards tend to use high-power integrated circuits and can benefit from the ATS-14B-197-C1-R0\'s efficient thermal cooling capabilities. Additionally, high-end computers and servers use these components to ensure their components remain stable and within operational temperature ranges.
The ATS-14B-197-C1-R0 is an effective thermal heat sink for cooling sensitive electrical components. Its efficient heat transfer and thermal mass help keep temperatures low and provide reliable cooling performance. This makes it an ideal choice for a variety of electronics applications, from mobile phones and tablets to high-end computers and servers.
The specific data is subject to PDF, and the above content is for reference