| Allicdata Part #: | ATS-14B-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-14B-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are designed to transfer heat away from the source of the heat into the ambient environment. This process of heat dissipation is essential for the proper functioning of many electronic devices. The ATS-14B-20-C1-R0 is a combination of low-profile \'O\' style air-cooled and pin-finned heat sinks that are specifically designed to ensure efficient heat transfer from a surface-mount application.
Application Field
The ATS-14B-20-C1-R0 is ideally suited for use in surface-mount applications that require a low profile, compact heat sink solution. The device is capable of dissipating up to 14 watts of power when mounted on a PCB. It is also capable of dissipating high-power components such as processors, FPGAs, and ASICs. Additionally, the ATS-14B-20-C1-R0 is designed to ensure compatibility with a range of active and passive cooling components, providing the user with more flexibility in their design.
Working Principle
The ATS-14B-20-C1-R0 employs a two-stage heat transfer system to ensure that heat is efficiently dissipated away from the source. The first stage involves the use of a pin-finned aluminum base that is thermally connected to the source. This base then dissipates heat through the use of a combination of convection, radiation, and conduction. The second stage of the heat transfer process is achieved through the use of an \'O\' style air-cooled heat sink. This \'O\' style heat sink is designed to directly cool the components on the PCB by utilizing the natural flow of air across the PCB. As a result, the ATS-14B-20-C1-R0 provides efficient and reliable heat dissipation, while still remaining compact in size.
Conclusion
The ATS-14B-20-C1-R0 is a highly efficient low-profile surface-mount thermal solution. It can be safely used to dissipate up to 14 watts of heat from components such as processors, FPGAs, and ASICs. Additionally, this heat sink is designed to be compatible with both active and passive cooling components. The ATS-14B-20-C1-R0 combines a pin-finned aluminum base with an \'O\' style air-cooled heat sink to ensure the efficient transfer of heat away from the source. As a result, this combination is able to provide efficient and reliable heat dissipation while still maintaining its compact design.
The specific data is subject to PDF, and the above content is for reference