| Allicdata Part #: | ATS-14B-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-14B-20-C3-R0 |
| Price: | $ 4.62 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15737 |
| 30 +: | $ 3.92658 |
| 50 +: | $ 3.69558 |
| 100 +: | $ 3.46469 |
| 250 +: | $ 3.23369 |
| 500 +: | $ 3.00271 |
| 1000 +: | $ 2.94496 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical for the performance and longevity of electronic devices. With the constant advancement of technology and the increasing miniaturization of components, and the ever-growing need for faster processors and graphics cards, today’s electronic devices are becoming more powerful. But this power also generates more heat, making thermal management dedicated to the control of heat dissipation in these systems an essential component. Heat sinks are one of the most commonly used methods of thermal management; they are designed to dissipate heat away from components by conducting and convecting the heat to ambient air.
ATS-14B-20-C3-R0 is a type of heat sink designed to effectively dissipate heat away from electronic components in high-powered systems. It is a two-part heat sink consisting of an aluminum base and an attached extruded fin heat sink. It is designed to be easily mounted to a circuit board or other surface, with mounting screws provided on the base. The aluminum base is connected to the fins in the extruded heat sink, allowing for the rapid transfer of heat from the source to the fins. The fins and knurl design of the heat sink help to dissipate heat by providing a larger surface area that increases the rate of convection.
The ATS-14B-20-C3-R0 heat sink is designed to be used in high-powered systems, where effective thermal management is essential. It is often used in applications such as telecommunications, military, and aerospace systems where components generate a large amount of heat. It is also used in high-powered electronics such as power meters, amplifiers, and test and measurement equipment. The heat sink’s mounting holes are compatible with components of various standard sizes, making it easier to mount and compatible with many different types of systems.
The aluminum base and extruded fins of the ATS-14B-20-C3-R0 heat sink allow it to dissipate heat quickly and efficiently. It is designed to be stable and reliable, with thickened fins for better heat dissipation and more reliable performance. The heat sink is also corrosion-resistant, making it ideal for use in harsh environments or extreme temperatures.
The ATS-14B-20-C3-R0 heat sink is a great choice for thermal management in high-powered systems. It is designed to dissipate heat quickly and efficiently, with a corrosion-resistant design that is stable and reliable. The heat sink’s mounting holes are compatible with components of various standard sizes, making it easy to mount and use in a wide range of applications. With its quality construction and effectiveness, it is an ideal choice for any system needing efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference