| Allicdata Part #: | ATS-14B-204-C3-R0-ND |
| Manufacturer Part#: |
ATS-14B-204-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-204-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55068 |
| 30 +: | $ 3.35328 |
| 50 +: | $ 3.15605 |
| 100 +: | $ 2.95880 |
| 250 +: | $ 2.76154 |
| 500 +: | $ 2.56429 |
| 1000 +: | $ 2.51498 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are used to transfer heat from a hot source to a cold sink. ATS-14B-204-C3-R0 is a thermal module that is designed to improve the cooling performance of any electronic device. It utilizes a combination of convection and conduction to dissipate the heat generated by the components in the device. This device is most commonly used in computers, servers, and other electronics.
The ATS-14B-204-C3-R0 has a unique design that makes it effective in transferring heat quickly and efficiently. The device comprises of two parts: a base and a cooler. The base is usually made up of aluminum, copper, or steel and can be combined with other materials. This structure is important to provide a strong foundation for the device and to evenly distribute the heat along its surface. The cooler is typically composed of specialized aluminum materials with heat pipes embedded within it. These heat pipes draw heat away from the device and disperse it into the air.
The ATS-14B-204-C3-R0 also uses a fan to provide additional cooling power. The fan is mounted on the top of the device and can be adjusted to increase or decrease the airflow. This airflow reduces the temperature within the device, improving its efficiency and ensuring the components are adequately cooled. The fan can also be placed in different positions to improve cooling performance further.
The ATS-14B-204-C3-R0 thermal module functions by transferring heat from the components into the device\'s heat sink. Heat is then conducted through the cooler and its heat pipes and is dispersed into the air. As the temperature increases, fan speed is automatically adjusted to regulate heat levels and maintain the required temperature within the device. This ensures the components are not damaged by overheating.
The ATS-14B-204-C3-R0 thermal module is an effective and reliable solution for controlling the temperature of any electronic device. Due to its ease of use and efficient cooling design, it is widely used in various applications such as microprocessors, graphic cards, motherboards, and memory modules. It is an essential part for ensuring the safe functioning of high-performance computers, workstations, and other high-load electronic devices.
The specific data is subject to PDF, and the above content is for reference