| Allicdata Part #: | ATS-14B-25-C1-R0-ND |
| Manufacturer Part#: |
ATS-14B-25-C1-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-25-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management systems play an increasingly important role in modern electronic applications. Large electronic assemblies are typically mounted on printed circuit boards, and as these assemblies become denser and more densely packed, it is essential to ensure adequate heat distribution between them. A key component in achieving this goal is the use of a thermal-heat sink, which is designed to dissipate heat away from the assembly and keep its temperatures at manageable levels.
The ATS-14B-25-C1-R0 is a popular thermal-heat sink that offers excellent performance and high efficiency. Its unique design is based on a set of stacked fin profiles that are connected together in a sealed thermal-heat sink assembly. The fin profiles are constructed from high-grade aluminum, and the fins are arranged in such a way to ensure that sufficient airflow is created within the assembly. This helps to ensure that the dissipated heat is distributed efficiently and evenly throughout the thermal-heat sink.
The ATS-14B-25-C1-R0 thermal-heat sink\'s application field is particularly broad, which is a testament to its efficiency and versatility. It can be used in a wide variety of applications, ranging from computing and telecommunications to home entertainment systems and other consumer electronics systems. In each case, the thermal-heat sink can be relied upon to provide outstanding performance, with low noise levels, excellent thermal management, efficient heat dissipation, and long life.
In terms of working principles, the ATS-14B-25-C1-R0 thermal-heat sink works by absorbing heat from the components mounted in its assembly. The fin profile design ensures that a sufficient amount of air is allowed to flow between the fins, which helps to carry the heat away from the components. The heat is then dissipated away from the thermal-heat sink by the set of cooling fins, which are designed to expel the heat onto the surrounding environment. This allows for effective and efficient cooling, and helps to ensure that the electronics housed in the thermal-heat sink remain at a manageable temperature.
The ATS-14B-25-C1-R0 thermal-heat sink is a highly efficient and successful component of any electronics assembly. Its efficient heat dissipation and its ability to support a wide range of applications has made it a popular choice among electronic engineers and system builders. Its low noise levels, efficient performance, and long life make it a reliable and dependable solution for any thermal-heat sink application.
The specific data is subject to PDF, and the above content is for reference