ATS-14B-28-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-14B-28-C3-R0-ND

Manufacturer Part#:

ATS-14B-28-C3-R0

Price: $ 7.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14B-28-C3-R0 datasheetATS-14B-28-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.66603
30 +: $ 6.29559
50 +: $ 5.92528
100 +: $ 5.55490
250 +: $ 5.18457
500 +: $ 4.81424
1000 +: $ 4.72167
Stock 1000Can Ship Immediately
$ 7.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.62°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices that are designed to transfer and maintain thermal energy in various applications. The ATS-14B-28-C3-R0 is a heat sink that is designed for optimum thermal management. It is designed with a high heat dissipation rate of up to 200W/m2, making it an ideal choice for cooling high-power components.

This heat sink is made from aluminum alloy, giving it excellent durability and heat dissipation properties. The aluminum alloy is designed to be lightweight yet rugged, offering excellent performance in extreme conditions. The design includes a heat-blocking fin that helps to further reduce the heat produced by the component before it reaches the heat sink.

The ATS-14B-28-C3-R0 heat sink is designed to work in a variety of applications. It is suitable for components that require efficient thermal management, such as CPUs, GPUs, field-programmable gate arrays (FPGAs), and other electronics. It is also suitable for industrial applications, such as robotics, automated machines, and medical equipment.

The ATS-14B-28-C3-R0 heat sink is designed with a three-dimensional fin profile that maximizes heat dissipation. The heat sink’s profile enables air to be drawn at an increased rate, providing greater dissipating effectiveness. It also has excellent air-flow characteristics, reducing airflow resistance and improving cooling efficiency. This heat sink has a thermal resistance of just 0.15 C/W, allowing it to operate reliably at higher temperatures.

The ATS-14B-28-C3-R0 heat sink is designed with quick mounting technology, making it quick and easy to install. The thermal tape surface secures the heat sink in place, further reducing installation time. The heat sink is also designed with an electroplated surface that offers high durability in harsh environments. As such, it is suitable for applications that require reliable performance in harsh environments.

The ATS-14B-28-C3-R0 heat sink is designed for excellent thermal management, making it an ideal choice for components that require efficient cooling. The heat sink’s fin profile maximizes heat dissipation, allowing air to be drawn at an increased rate. Additionally, the heat sink is designed with quick mounting technology and an electroplated surface, giving it excellent performance even in harsh environments. As such, this heat sink is suitable for various applications, including industrial and medical equipment.

The specific data is subject to PDF, and the above content is for reference

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