| Allicdata Part #: | ATS-14B-42-C1-R0-ND |
| Manufacturer Part#: |
ATS-14B-42-C1-R0 |
| Price: | $ 6.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X22.86MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-42-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.82939 |
| 30 +: | $ 5.50578 |
| 50 +: | $ 5.18188 |
| 100 +: | $ 4.85806 |
| 250 +: | $ 4.53419 |
| 500 +: | $ 4.21032 |
| 1000 +: | $ 4.12935 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14B-42-C1-R0 thermal-heat sink is one of the most commonly used cooling solutions for electronic components. This thermoelectric device is ideal for both consumer and industrial applications due to its ease of installation and cost effectiveness. The device is capable of actively circulating and transferring heat using the Peltier effect.
The ATS-14B-42-C1-R0 thermal-heat sink is a thermoelectric device that operates by directly converting electrical energy into thermal energy. The device works by utilizing the Peltier effect, which states that when two electrical conductors are attached to an insulated junction, a temperature difference will be created when current flows across the junction. This temperature difference can be used to actively cool an electronic component by transferring the heat from the component to the heat sink.
The main components of the ATS-14B-42-C1-R0 thermal-heat sink are a fan, base plate, Peltier plate and two thermoelectric modules. The fan is responsible for circulating air and removing heat from the exhausted air in order to maintain temperature control. The base plate is designed to provide a stable mounting point for the junction and the Peltier plate. The Peltier plate is made up of two layers; the top layer carries current and the bottom layer holds the thermoelectric module. The two thermoelectric modules are connected to the Peltier plate and work together to transfer heat from the electronic component to the heat sink.
The ATS-14B-42-C1-R0 thermal-heat sink is most commonly used as a cooling solution for electronics components such as CPUs, GPUs, power transistors or RF amplifiers. The device is also well suited for use in environments where there is limited space or tight installation requirements. The ATS-14B-42-C1-R0 is easy to integrate and can be used in either a single device installation or multiple-device configuration. The device also has a highly efficient self-contained design, which reduces required maintenance and increases reliability.
The ATS-14B-42-C1-R0 thermal-heat sink is a reliable and cost effective solution for cooling electronic components. The device is capable of actively transferring heat and maintaining temperature control. The device can be easily installed and is suited to most applications, making it a popular solution for industries where thermal management is important.
The specific data is subject to PDF, and the above content is for reference