| Allicdata Part #: | ATS-14B-51-C3-R0-ND |
| Manufacturer Part#: |
ATS-14B-51-C3-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-51-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28419 |
| 30 +: | $ 3.19557 |
| 50 +: | $ 3.01795 |
| 100 +: | $ 2.84042 |
| 250 +: | $ 2.66291 |
| 500 +: | $ 2.57415 |
| 1000 +: | $ 2.30786 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14B-51-C3-R0 is a thermal - heat sink from the ATS-14 Series of heatsinks manufactured by the Advanced Thermal Solutions, Inc. The ATS-14 Series of heat sinks are designed to handle extreme conditions in demanding applications, including gaming consoles, automotive electronics, network switch gear, and defense electronics.
The ATS-14B-51-C3-R0 is a highly efficient heat sink designed for dissipating thermal energy from components such as CPUs and GPUs. It features a heavy duty aluminum construction and a unique internal fin design that maximizes heat dissipation and flow rate. The ATS-14B-51-C3-R0 uses a clip-on heatsink assembly to provide maximum air flow and heat dissipation.
The ATS-14B-51-C3-R0 is suitable for applications requiring thermal management of components with high ambient temperatures. It is designed to enable superior airflow, through the use of a unique fin and airflow pattern that creates a swirling turbulence while eliminating dead air pockets for more efficient cooling. It also features a low profile design which allows for a reduced height profile for improved thermal management in confined and crowded electronic configurations.
The ATS-14B-51-C3-R0 has a wide range of applications in the electronics and computer industry, such as in gaming consoles, automotive electronics, network switch gear, and defense electronics. The heatsink is designed with a large contact surface for efficient heat transfer and a thermal resistance of 0.11°C/W. This low thermal resistance allows for superior power efficiency and longer life spans in many of the above mentioned applications. The ATS-14B-51-C3-R0 also features optimal noise and vibration characteristics, making it ideal for use in applications where noise and vibration reduction is a necessity.
The working principle of the ATS-14B-51-C3-R0 utilizes an internal fan and airflow pattern to create a swirling airflow that optimizes the cooling process. The fan draw air from inside the unit and forces it outwards through the fins of the heat sink. The air is then drawn into the circulating air stream, drawing away the heat from the components. This method ensures a high rate of heat dissipation and eliminates “dead spots” for more efficient cooling. The ATS-14B-51-C3-R0 also features a built-in thermal control system which helps maintain an ambient temperature of 40°C, ensuring efficient cooling performance in demanding applications.
The ATS-14B-51-C3-R0 is an ideal thermal-heat sink for a variety of applications where superior cooling performance is required. It features a unique internal fin design and low profile design that optimizes airflow and heat dissipation. The ATS-14B-51-C3-R0 is also designed with minimal noise and vibration levels, making it perfect for applications that require low noise and vibration levels. The ATS-14B-51-C3-R0 is highly efficient, durable, and reliable, making it ideal for many types of applications.
The specific data is subject to PDF, and the above content is for reference