| Allicdata Part #: | ATS-14B-58-C1-R0-ND |
| Manufacturer Part#: |
ATS-14B-58-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-58-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
Thermal - Heat Sinks are designed to dissipate heat from a device to the surrounding environment. These devices can be made up of solid or liquid components and are frequently used in computer systems, in home appliances and in industrial applications. One of these thermal designs is the ATS-14B-58-C1-R0, which is designed to manage the thermal performance of multiple devices.
ATS-14B-58-C1-R0 Application Field and Working Principle
The ATS-14B-58-C1-R0 is a highly efficient, thermally optimized thermal management solution for multiple electronic components. The design utilizes a combination of metal and plastic materials to support the dissipative and non-dissipative characteristics of the application environment. The unit is optimized to provide low thermal resistance over a range of temperatures and comes with an integrated fan to provide additional cooling. The unit also features a dual-fan mode which further enhances the cooling performance.
The ATS-14B-58-C1-R0 is designed to dissipate heat from electronic components and can be used in a variety of applications such as consumer electronics, automotive, telecommunications, networking, computing and medical equipment. The unit is also suitable for use in highly-sensitive applications where rapid cooling of components is required.
The internal design and construction of the ATS-14B-58-C1-R0 consists of a ceramic substrate onto which multiple chip components can be attach, the substrate is coated with a flexible plastic material that ensures good thermal transfer between components and the surrounding environment. The substrate is then mounted onto a metal frame which acts as a heat spreader and a fan to improve cooling. The fan is controlled automatically and adjusts the speed of the fan based on the temperature of the substrate. The fan will switch to high speed when the temperature rises above a preset threshold point and will switch back to low speed when the temperature falls below the threshold.
The ATS-14B-58-C1-R0 is designed to provide a cost-effective solution for applications requiring up to 14 watts of cooling, up to 58 grams of metal mass for heat spreading and up to 1.2 Celsius thermal resistance for the entire system. This heatsink provides the most efficient cooling performance, is low power, light weight, low cost and easy to operate, making it ideal for a multitude of applications.
Conclusion
The ATS-14B-58-C1-R0 is a thermally optimized heat sink designed to dissipate heat from electronic components. Utilizing a combination of metal and plastic materials, it is capable of providing efficient cooling over a wide range of temperatures. The fan control feature provides additional cooling and the integrated fan allows for the unit to be used in highly-sensitive applications. This makes the ATS-14B-58-C1-R0 ideal for a wide range of applications that require up to 14 watts of cooling, up to 58 grams of metal mass for heat spreading and up to 1.2 Celsius thermal resistance for the entire system.
The specific data is subject to PDF, and the above content is for reference