| Allicdata Part #: | ATS-14B-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-14B-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-14B-60-C1-R0 is a thermal heat sink designed for applications such as computer cooling, automotive electronics, and consumer electronics. A heat sink absorbs and dissipates heat generated by an electronic device, allowing it to operate at a lower temperature and thus improving its performance and reliability. In addition, this type of thermal heat sink can reduce the amount of noise generated by an electronic device due to the additional cooling effect it provides.
A heat sink typically consists of a base that is mounted to an electronic device, and a series of fins which are arranged on the base in a manner that allows for a maximum amount of heat exchange between the device and the surrounding air. The ATS-14B-60-C1-R0 has a base that measures 60mm x 60mm, with the fins arranged in a rectangular grid pattern on the base. The fins form a heat-dissipating network in order to allow the airflow to carry heat away from the device being cooled. The fins are made from a durable aluminum extrusion and are plated with a corrosion-resistant nickel-chromium alloy.
The ATS-14B-60-C1-R0 has a total thermal resistance of 0.14°C/W, meaning that it can effectively dissipate 16.7 watts of heat from an electronic device at a temperature difference of 1 degree Celsius. This thermal resistance is achieved by the design of the fins, which act as a large surface area for heat exchange, allowing the heat from the device to be efficiently pulled away into the air. The fins also feature a uniform thermal conduction pattern, which further enhances the heat exchange between the device and the fins.
In addition to its superior thermal performance, the ATS-14B-60-C1-R0 also has a low profile design, measuring just 14mm in height. This profile makes it ideal for applications where space is limited, such as in laptop computers or other small form factor devices. The heat sink also contains a patented air-flow optimization system, which helps maximize the transfer of heat from the device to the fins via an efficient air-flow pattern.
Overall, the ATS-14B-60-C1-R0 thermal heat sink provides superior thermal performance, low profile design, and an optimized air-flow system for effective heat transfer. This makes it perfect for applications like computer cooling, automotive electronics, and consumer electronics, where efficient heat dissipation is desired.
The specific data is subject to PDF, and the above content is for reference