ATS-14B-75-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.95°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-14B-75-C1-R0 Heat Sinks
Heat sinks are thermal management components that are used primarily to dissipate heat from an electronic device or circuit. In order to function effectively, a heat sink must have good thermal contact with the device that is generating the heat, as well as a good airflow path. The ATS-14B-75-C1-R0 is a heatsink specifically designed for this purpose.ATS-14B-75-C1-R0 Features
The ATS-14B-75-C1-R0 is a stepped fin heatsink with a 70 x 70 mm (0.56 in. x 0.56 in.) footprint. It is made of cold-rolled steel and has a height of 14 mm (0.56 in.). The ATS-14B-75-C1-R0 also features patented stepped fins that are designed to provide excellent heat-dissipating efficiency. The ATS-14B-75-C1-R0 also has the advantage of being able to fit into tighter spaces.Application Fields
The ATS-14B-75-C1-R0 is suitable for applications that require high thermal dissipation, such as transistors, integrated circuits, solenoids, and rectifiers. This heatsink is also suitable for use in consumer electronics, such as televisions, displays, computers, and audio equipment. The ATS-14B-75-C1-R0 can also be used in the industrial and automotive sectors for applications such as relays, solenoids, and ignitors.Working Principle
The ATS-14B-75-C1-R0 heatsink functions as a “heat pipe” which extracts heat from the device that is generating it, then dissipates the heat away into the surrounding environment. Heat is transferred from the device to the heatsink by convection, conduction, and radiation. Convection is the process of heat transfer through air or liquid, conduction is the transfer of heat through solid material, and radiation is the transfer of heat through electromagnetic waves.The ATS-14B-75-C1-R0 features patented stepped fins which create channels for air to travel in and out of the heatsink, thus aiding in the convection of heat. The stepped fins also function to increase the surface area that is available for conduction and radiation. The increased surface area provides more heat radiation to the surrounding environment, thus improving the heatsink’s overall efficiency.Conclusion
The ATS-14B-75-C1-R0 is an ideal solution for applications that require highly efficient heat dissipation. Its unique stepped fin design allows it to fit into tighter spaces, while the improved surface area provides superior heat transfer performance. The ATS-14B-75-C1-R0 is suitable for a wide range of applications, including consumer, industrial, and automotive products.

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