| Allicdata Part #: | ATS-14B-81-C3-R0-ND |
| Manufacturer Part#: |
ATS-14B-81-C3-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14B-81-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28419 |
| 30 +: | $ 3.19557 |
| 50 +: | $ 3.01795 |
| 100 +: | $ 2.84042 |
| 250 +: | $ 2.66291 |
| 500 +: | $ 2.57415 |
| 1000 +: | $ 2.30786 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14B-81-C3-R0 Heat Sink is a thermal device designed to help optimize and protect critical components from extreme temperatures and potential damage. This device is designed to disperse heat from hot spots and components in an electronics application. A heat sink helps to maintain the temperature level of components and systems during usage. The use of an ATS-14B-81-C3-R0 Heat Sink thus allow to improve operational stability, reduce thermal noise, as well as maintain system and component reliability.
The ATS-14B-81-C3-R0 Heat Sink has a range of key features, such as its minimized size, weight, and power consumption. Its structure is built of aluminum that can be thus effective at removing heat from PCB components while staying lightweight. The device\'s structure is designed for minimal air resistance and optimal heat exchange. Additionally, it comes with a thermal conductivity value of 4.45 W/mK, which gives it an adequate performance.
One of the primary application fields for the ATS-14B-81-C3-R0 Heat Sink is that of telecommunications. It can be used to help disperse the heat from transistors and other components during transmission and telecommunication activities. Additionally, it is used in applications such as automotive, computer and industrial applications. The heat sink is ideal for improving the system efficiency and cooling performance of high-intensity devices and systems.
The working principle of the ATS-14B-81-C3-R0 Heat Sink largely revolves around its excellent thermal characteristics. The device is designed to absorb and dissipate the heat produced by components in a system. Heat is absorbed from the components, converted into kinetic energy, and then cooled with the help of the heat sink. This in turn helps to reduce the temperature of the components and the surrounding system to limit damage risks.
The ATS-14B-81-C3-R0 Heat Sink is an effective thermal device that allows for efficient cooling and reduced temperature levels of components and systems in various professional applications. With its aluminum design, optimal air resistance and heat exchange, and lightweight size and weight, this device allows for a reliable performance and improved efficiency.
The specific data is subject to PDF, and the above content is for reference