ATS-14B-85-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-14B-85-C1-R0-ND

Manufacturer Part#:

ATS-14B-85-C1-R0

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14B-85-C1-R0 datasheetATS-14B-85-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.92446
30 +: $ 2.84550
50 +: $ 2.68733
100 +: $ 2.52926
250 +: $ 2.37119
500 +: $ 2.29216
1000 +: $ 2.05503
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 23.94°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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  • Introduction to Thermal Heat Sinks
    Thermal heat sinks are one of the most important components for controlling the heat levels of electrical and electronic devices. Thermal heat sinks are responsible for dissipating excess heat away from the component in order to maintain safe operating temperatures. Thermal heat sinks are usually made of aluminum or copper material and consist of a large metal finned base with a clip or thermal pad attached to the base.
  • ATS-14B-85-C1-R0 Application Field
    The ATS-14B-85-C1-R0 is a thermal heat sink designed to provide cooling solutions for power electronic applications. It has 12 fins with a fin pitch of 5.5mm and a through-hole diameter of 1.8mm. The base of the heatsink is made of aluminum alloy and the fin is made from copper, which makes it an excellent choice for power transmission applications.
  • ATS-14B-85-C1-R0 Working Principle
    The ATS-14B-85-C1-R0 utilizes convection cooling to dissipate heat from the components. Heat is generated within the component due to increased electrical current and/or temperature. This heat is then transferred through the component to the metal fins of the thermal heat sink. The fin shape and size, as well as the air movement around the fins, helps to dissipate the heat away from the component, thus lowering the operating temperature.
  • Conclusion
    The ATS-14B-85-C1-R0 thermal heat sink is a highly efficient solution for controlling the operating temperatures of power electronic components. The metal base and copper-filled fin design increases heat transfer and air circulation, efficiently dissipating heat away from the component. This makes it an ideal choice for cooling applications.

The specific data is subject to PDF, and the above content is for reference

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