| Allicdata Part #: | ATS-14C-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-14C-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14C-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an integral part of many electronic designs, and it has become increasingly important as technologies evolve and devices become more complicated. Heat sinks are components that can be used to manage heat generated by electronic devices. The ATS-14C-10-C3-R0 is a heat sink designed for thermal management applications.
This heat sink is designed to provide effective thermal management in high power applications. It consists of a large aluminum block with a copper thermal element embedded inside. The block has a finned surface to increase the surface area and help transfer heat away from the device. The thermal element is a copper plate with fins designed to dissipate heat more quickly and evenly. This is an efficient way to spread the heat generated by the electronic components.
The ATS-14C-10-C3-R0 heat sink is capable of providing efficient cooling for devices in a wide range of applications. It is suitable for use in consumer electronics, industrial systems, commercial equipment, and automotive applications. It can also be used in low-power applications such as medical, aerospace, and telecommunications equipment. The heat sink is capable of handling up to 25 watts of power with a heatsink temperature of 47 degrees Celsius.
The ATS-14C-10-C3-R0 heat sink is reliable and easy to install. It has a low profile design and is extremely compact. This makes it an ideal choice for applications where space is limited. The heat sink can be easily mounted on any flat surface and is securely held in place with screws. It is designed to be mechanically and thermally robust.
The working principle of the ATS-14C-10-C3-R0 heat sink is relatively simple. Heat generated by the electronic components is transferred to the aluminum block and copper thermal element. The thermal element then dissipates the heat away from the device. The fins in the thermal element act as a heatsink, providing an efficient way to move the heat away from the device and into the ambient air.
The ATS-14C-10-C3-R0 heat sink is a reliable and effective solution for thermal management applications. It is suitable for a wide range of devices and can handle up to 25 watts of power. It is easy to install with a low profile design, and it works by transferring heat away from the device and into the ambient air. For these reasons, it is an ideal solution for managing the heat generated by electronic components.
The specific data is subject to PDF, and the above content is for reference