| Allicdata Part #: | ATS-14C-104-C1-R1-ND |
| Manufacturer Part#: |
ATS-14C-104-C1-R1 |
| Price: | $ 4.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14C-104-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.82851 |
| 30 +: | $ 3.61599 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 25.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are critical components of any thermal management system. They are involved in the transfer of thermal energy from one environment to another, usually from the inside to the outside of an object. The ATS-14C-104-C1-R1 thermal heat sink is designed to provide a high thermal performance and low thermal resistance. This allows for improved thermal management of electronic devices.
The ATS-14C-104-C1-R1 is made up of a highly conductive base with a thermally conductive extrusion. This combination provides a highly efficient thermal transfer as well as a highly efficient heat dissipation. The extrusion has a profile designed to optimize the thermal transfer and to provide a snug fit for the electronic component. It also has low thermal resistance and a high thermal conductivity, allowing for a more even and effective distribution of the thermal energy.
The base of the ATS-14C-104-C1-R1 is constructed of a special material which ensures a low thermal resistance, allowing for a better thermal transfer. This material is also highly wear-resistant making it suitable for applications where the heat sink is exposed to vibration and thermal cycling. The base also provides a robust and secure attachment for the thermal transfer material, ensuring a reliable thermal transfer between the heat sink and the electronic components.
The working principle of a thermal heat sink is to transfer thermal energy away from a device by increasing the overall surface area of the device. The greater the surface area, the more thermal energy can be dissipated away. The ATS-14C-104-C1-R1 is designed to maximize the surface area of the device, allowing for a greater volume of heat to be dissipated away. The extrusion has a profile which further increases the surface area, allowing for a greater thermal energy transfer.
The ATS-14C-104-C1-R1 is ideal for use in a variety of applications. It can be found in applications such as personal computers, embedded systems, automotive systems, industrial controls, medical systems, home entertainment systems, and consumer electronics. This high performance and low thermal resistance thermal heat sink is able to provide a reliable and stable thermal transfer and is the perfect choice for any application that requires thermal management.
The ATS-14C-104-C1-R1 is a great choice for any application that requires high performance and low thermal resistance. Its combination of high thermal conductivity and low thermal resistance provide a highly efficient thermal transfer and its robust construction ensures a reliable and secure attachment for the thermal transfer material. This makes it perfect for applications where thermal management is critical.
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