ATS-14C-16-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
The ATS-14C-16-C1-R0 is a thermal solution designed to manage the heat generated by high-powered computing components and systems. It is a type of heat sink, which is basically a device that is designed to transfer heat away from a component or system. By effectively dissipating heat, it enables the component or system to remain cool and operate efficiently without any temperatures getting too high, which can ultimately lead to failure.

Application Field of ATS-14C-16-C1-R0 Heat Sink
The ATS-14C-16-C1-R0 heat sink is a high-performance thermal solution that can handle much higher heat dissipation levels than traditional aluminum or copper-based heat sinks. It is designed for use in high-powered systems and components, such as CPUs, GPUs, FPGAs, power amplifiers, high-end graphics cards, and so on. It is also suitable for use in temperature-controlled industrial environments, such as assembly and production lines. In addition, the ATS-14C-16-C1-R0 heat sink is a great choice for overclocking, which is the practice of pushing a system or component beyond its factory performance limits.

Working Principle of ATS-14C-16-C1-R0 Heat Sink
The ATS-14C-16-C1-R0 heat sink uses a combination of technologies to effectively dissipate heat away from a component or system. It comes with a high-efficiency fan, which creates a flow of air that carries heat away from the component or system. The fan is enclosed in a case made of aluminum, which dissipates heat away from the fan and into the surrounding air. The fan is surrounded by a heat transfer fin array, which is designed to conduct heat away from the component or system and into the fins. Then, the fins aid in convective heat loss, as the air particles heated up by the fins rise and the cooler air from the bottom of the heat sink is drawn in and cooled down.

Conclusion
In conclusion, the ATS-14C-16-C1-R0 heat sink is a highly efficient thermal solution. It\'s designed for use in high-powered systems and components, and is also perfect for overclocking. It utilizes a combination of technologies, including a high-efficiency fan, an aluminum case, and a heat transfer fin array, in order to effectively dissipate heat away from a component or system. With these features, the ATS-14C-16-C1-R0 heat sink is capable of handling higher heat dissipation levels than traditional aluminum or copper-based heat sinks.

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