| Allicdata Part #: | ATS-14C-192-C1-R0-ND |
| Manufacturer Part#: |
ATS-14C-192-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14C-192-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks play a fundamental role in the cooling of various electronic devices, especially ones that generate a significant amount of heat. The ATS-14C-192-C1-R0 heat sink is a high thermal performance device that can be used to cool all kinds of electronic components.
The ATS-14C-192-C1-R0 heat sink is made from an aluminum extrusion, and is designed for minimal thermal resistance. This makes it suitable for flexible use in various applications. The design of the heat sink also reduces the amount of air flow needed to maintain a stable temperature within the system.
The specific applications of the ATS-14C-192-C1-R0 heat sink are mainly related to cooling power sources such as DC/DC converters and power transistors. This heat sink can also be used in many other applications to increase cooling performance, such as in gas turbines, refrigerator compressors, and industrial chillers.
The ATS-14C-192-C1-R0 heat sink uses a thermally conductive ceramic material as its heat-conducting base. This makes it suitable for direct mounting on the device it is intended to cool. The extrusion profile of the heat sink also makes it suitable for less complicated temperature control. This makes it an ideal choice for many applications.
The working principle behind the ATS-14C-192-C1-R0 heat sink is the same as that of any other thermal heat sink – it dissipates thermal energy by conducting it away from the device being cooled to the surrounding ambient air. Heat generated by the device is absorbed by the heat sink, and the excess thermal energy is then dissipated to the environment. This helps keep the device temperature stable and within operating limits.
It is essential to have a good understanding of the working principle of the ATS-14C-192-C1-R0 heat sink in order to get the desired cooling performance. An efficient design of the heat sink can ensure that the cooling performance is raised to the optimal level and will also enable the optimum temperature control.
In order to ensure the best performance of the ATS-14C-192-C1-R0 heat sink, it is important to consider the device’s design parameters and the system requirements before purchasing one. This includes the power dissipation of the device, the thermal resistance, and the ambient temperature. When these factors are taken into consideration, one can make the best possible choice for their application.
The ATS-14C-192-C1-R0 heat sink is a great device for anyone who needs to cool an electronic device with minimal thermal resistance. Its compact design, efficient thermal performance, and thermal conductive ceramic make it an ideal choice for various applications. By understanding its working principle and taking into account the system’s requirements, more efficient operation and better performance can be achieved.
The specific data is subject to PDF, and the above content is for reference