ATS-14C-197-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.90°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat-sink technology is essential for controlling and dispersing heat generated from electrical components. Heat sinks are generally composed of a highly conductive heat producing element (e.g. aluminum or copper), fins, radiators, etc. to dissipate the heat. The ATS-14C-197-C2-R0 is a large scale, low resistive heat sink designed for cooling integrated circuits. It features an efficient fin design incorporating convection-cooled vanes to lower the thermal resistance of the heatsink, allowing the ultimate cooling solution for a variety of applications.

Application Fields

The ATS-14C-197-C2-R0 is highly applicable for cooling complex, multi-component or delicate integrated circuits, such as those found on motherboards, adaptors or servers. Its superior heat dissipation is able to help maintain temperature levels on boards, extending the lifespan of the device. This heatsink is also highly effective in providing cooling for high current environment, such as power amplifiers, or in system applications where high-density power levels are used.

Working Principle

The working principle of the ATS-14C-197-C2-R0 is based on the scattering of the heat produced by the electrical components. The heatsink consists of two plates — a base plate (or heat spreader) and a cover plate — and utilizes a fin design for increased surface area and transfer of heat away from the components as quickly as possible. The fin design allows air to flow across its surface, carrying the heat away from the base of the heatsink through convection. This ensures that the temperature of the heat producing element is kept low, and that the device will remain in a stable condition.

Conclusion

In conclusion, the ATS-14C-197-C2-R0 provides an effective and efficient cooling solution for integrated circuits in complex, high-end applications, providing users with assurance that their electronics are operating safely and within their optimal temperature range. With its superior heat dissipation and convection-cooled fin design, the ATS-14C-197-C2-R0 is a reliable and durable thermal heat sink to meet all of your needs.

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