| Allicdata Part #: | ATS-14C-209-C3-R0-ND |
| Manufacturer Part#: |
ATS-14C-209-C3-R0 |
| Price: | $ 6.38 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14C-209-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.73741 |
| 30 +: | $ 5.41842 |
| 50 +: | $ 5.09972 |
| 100 +: | $ 4.78094 |
| 250 +: | $ 4.46221 |
| 500 +: | $ 4.14348 |
| 1000 +: | $ 4.06380 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal management is a vital part of modern electronic device design and performance. The efficient management of heat generated by electronic components is essential to protecting components, as well as increasing system reliability and lifetime. The ATS-14C-209-C3-R0 thermal heat sink is a perfect and versatile product designed specifically for helping manage system heat and ensure optimal efficiency and performance.
The ATS-14C-209-C3-R0 is designed to fit in a wide range of applications, from the cooling of motherboards to the cooling of power distribution systems. Its highly efficient heat transfer design allows it to maximize surface contact with the component, while still allowing for adequate air circulation. Combined with its material construction, this allows for excellent thermal management and reliable functionality.
The ATS-14C-209-C3-R0 can be used in various applications, including in industrial, consumer, automotive, computer, and medical device cooling. It can be used to cool any component that requires a reliable thermal solution, such as CPUs, GPUs, APUs, memory modules, power supplies, hard drives, and more. Its versatile design makes it ideal for both external and internal heat sinks, complementing any thermal design.
As far as working principle is concerned, the ATS-14C-209-C3-R0 works on the same principle as other thermal heat sinks. It is designed to effectively transfer heat from its source to its surface area, where it is then dissipated into the surrounding environment by means of convection, often aided by the aid of fans. Its large surface area provides excellent heat dissipation, while its sturdy material construction ensures reliable functioning.
The ATS-14C-209-C3-R0 is also designed to be easy to use. Its slim profile allows it to fit neatly into tight spaces, while its versatile mounting options make it easy to install into any system. Furthermore, its low profile design means that it can be easily set up and used with minimal effort. Its robust construction also ensures reliable and durability performance.
In conclusion, the ATS-14C-209-C3-R0 thermal heat sink is an effective and reliable solution to thermal management. Its versatile design and robust construction make it ideal for a wide range of applications, while its easy-to-use setup ensures efficient operation. With its advanced materials, reliable functioning, and efficient heat transfer, it is sure to provide excellent performance and a long lifespan.
The specific data is subject to PDF, and the above content is for reference