| Allicdata Part #: | ATS-14C-36-C2-R0-ND |
| Manufacturer Part#: |
ATS-14C-36-C2-R0 |
| Price: | $ 5.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14C-36-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.23971 |
| 30 +: | $ 4.94865 |
| 50 +: | $ 4.65759 |
| 100 +: | $ 4.36647 |
| 250 +: | $ 4.07537 |
| 500 +: | $ 3.78427 |
| 1000 +: | $ 3.71150 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are the components of a device working to absorb and release heat, allowing the device to dissipate large amounts of power without affecting the operation or performance. The ATS-14C-36-C2-R0 is one such component, specialising in dissipating up to 400 Watts of thermal energy out of a device. It is extensively used in consumer, military and industrial grade applications.
The ATS-14C-36-C2-R0 is constructed from a very specific set of materials; a light-weight aluminium alloy combined with a special thermal compound to ensure high efficiency heat dissipation. The thin aluminium fins provide an incredible amount of surface area for the heat to transfer out of the device and into the air. Additionally, the heat sink is also designed in such a way that the air flow allows for better heat transfer and cooling.
The heat sink consists of an aluminium base plate that sits atop many thin aluminium fins which are soldered onto the base plate. Heat is conducted away from the device through the base plate and then transferred into the air as the air flows through the thin aluminium fins. The base plate is designed with high thermal conductivity material that ensures the best possible heat transfer efficiency. This is an important aspect of the heat sink’s design, as the base plate is responsible for conducting heat from the device to the air, and if it is not able to do this effectively then the heat sink’s overall performance will suffer.
The unique design of the ATS-14C-36-C2-R0 heat sink helps to maintain temperatures within devices, and lowers the stress on electrical components. This heat sink is capable of handling up to 400 Watts of thermal energy which allows for high performance electronics with power-hungry components. Its light-weight construction and resourceful design make it ideal for applications in military, consumer and industrial grade products that require reliable temperature maintenance and a light-weight, efficient heat sink.
With this product’s unique design, a smooth assembly process and a wide variety of available applications, the ATS-14C-36-C2-R0 is the perfect choice for many thermal applications that require effective heat dissipation. It can be used in commercial, industrial, and military applications, and in a wide variety of devices ranging from computers and servers to electronic systems, and can assist in many temperature management processes from cooling to temperature regulation.
The ATS-14C-36-C2-R0 thermal heat sink is the ideal solution for high performance, power-hungry components that demand temperature stability. It can handle up to 400 Watts of thermal energy, allowing for maximum performance from even the most demanding electronics.
The specific data is subject to PDF, and the above content is for reference