| Allicdata Part #: | ATS-14C-37-C1-R0-ND |
| Manufacturer Part#: |
ATS-14C-37-C1-R0 |
| Price: | $ 5.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14C-37-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.88124 |
| 30 +: | $ 4.60992 |
| 50 +: | $ 4.33881 |
| 100 +: | $ 4.06766 |
| 250 +: | $ 3.79648 |
| 500 +: | $ 3.52531 |
| 1000 +: | $ 3.45751 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.10°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sink is a device that is used to dissipate heat generated by electronic components or mechanisms. Heat sink helps keep an electronic component or a mechanism cool by taking away the excess heat and then disposing of it to ensure better performance and durability. The ATS-14C-37-C1-R0 thermal heat sink is one such device that is designed to dissipate heat and keep electronic components from overheating.
ATS-14C-37-C1-R0 Application Field and Working Principle
The ATS-14C-37-C1-R0 is mainly used in high-power switching circuits, power electronics, military electronic devices, and mobile phones. This thermal heat sink is designed for effective cooling of electronic components and can handle a wide range of applications.
The ATS-14C-37-C1-R0 thermal heat sink works by using convection and radiation to dissipate heat. The device is constructed with a highly efficient 3D aluminum fin structure. The fin structure increases the surface area to allow for more efficient heat transfer. This allows more air to move around the fins of the heat sink, taking away the excess heat and dissipating it into the atmosphere.
The ATS-14C-37-C1-R0 thermal heat sink also uses radiative cooling, which uses the radiation of the heat from the surface of the fins to dissipate the heat away from the device. This radiative cooling process helps to further reduce localized temperature raise and improve system cooling performance.
The thermal heat sink is also designed for easy and simple installation. It is designed to be easily installed onto circuit boards, eliminating the need for complex wiring and helping to reduce the cost of installation and maintenance. There is no need for additional soldering or wiring which makes it easier to install the device into existing electronic circuit boards.
The ATS-14C-37-C1-R0 thermal heat sink also offers high-performance thermal heat transfer efficiency as well as long-term reliability and durability. The device is made from high-temperature resistant materials and is designed to be corrosion resistant. This ensures that the heat sink has a long lifespan and low maintenance costs.
In conclusion, the ATS-14C-37-C1-R0 thermal heat sink is one of the most efficient and reliable devices on the market. It offers high-performance cooling with long-term reliability and durability. The device is easy to install and does not require additional wiring or soldering, reducing the costs of installation and maintenance. This makes the ATS-14C-37-C1-R0 thermal heat sink ideal for high-power switching circuits, power electronics, military electronic devices, and mobile phones.
The specific data is subject to PDF, and the above content is for reference