| Allicdata Part #: | ATS-14C-37-C2-R0-ND |
| Manufacturer Part#: |
ATS-14C-37-C2-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14C-37-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14C-37-C2-R0 is a compact and cost-effective thermal - heat sink designed for use in a variety of applications. The sink is made of die-cast aluminum with a black anodized finish, making it a durable solution for cooling semiconductor components.
ATS-14C-37-C2-R0 Application Field
The ATS-14C-37-C2-R0 thermal - heat sink is designed for use in a variety of applications, including computer systems, wireless communication systems, consumer electronics, audio amplifiers, microwave ovens, switches, power supplies, and more. It is capable of dissipating up to 37 watts of heat in an environment of 0.49 sq. in of surface area. This makes it an ideal choice for cooling components in small-scale electronic devices and systems.
ATS-14C-37-C2-R0 Working Principle
The ATS-14C-37-C2-R0 works on the principle of passive convective cooling—the removal of heat from a surface by air movement. The thermal - heat sink comes with a single-piece aluminum clip and self-adhesive neoprene pad which adhere to the component being cooled. This creates a thermal connection between the component and the sink, allowing air movement to occur and heat to be dissipated. The air is cooled as it passes through the fins of the sink, allowing it to more easily remove heat from the component.
The ATS-14C-37-C2-R0 also features an integrated spring-loaded clip design which makes it easy to mount and secure components to the sink. The aluminum clip comes with four adjustable settings to ensure that the correct tension is applied to the component being cooled, regardless of its size and weight. This allows the sink to more effectively transfer heat from the component.
The ATS-14C-37-C2-R0 also features an innovative fin design which maximizes the efficiency of the cooling process. This design consists of a series of parallel fins which are angled in order to create turbulence in the air flow. This turbulence causes more air to pass through the sink, resulting in increased heat dissipation.
The ATS-14C-37-C2-R0 thermal - heat sink is an ideal choice for cooling components in small-scale electronic devices and systems. It is capable of dissipating up to 37 watts of heat in an environment of 0.49 sq. in of surface area, making it a cost-effective, durable, and versatile solution.
The specific data is subject to PDF, and the above content is for reference