ATS-14C-42-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-14C-42-C2-R0-ND

Manufacturer Part#:

ATS-14C-42-C2-R0

Price: $ 7.15
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X22.86MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14C-42-C2-R0 datasheetATS-14C-42-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.43104
30 +: $ 6.07383
50 +: $ 5.71662
100 +: $ 5.35928
250 +: $ 5.00200
500 +: $ 4.64471
1000 +: $ 4.55539
Stock 1000Can Ship Immediately
$ 7.15
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.31°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-14C-42-C2-R0 is a type of thermal - heat sink, which is designed to dissipate heat from the system in order to keep components at optimal temperatures. This type of heat sink is a cost-effective method of cooling compared to other cooling solutions. The design of the ATS-14C-42-C2-R0 consists of several components. The baseplate is made of anodized aluminum for efficient heat transfer and is fitted with a heat sink fin assembly. The heat sink fins are designed to increase the surface area of the dissipating material, which allows greater cooling capacity. The cooling fins are then connected to a copper heat pipe or vapor chamber, which acts as an efficient, low-cost heat spreader. This heat sink is also designed with a fan to help with air circulation and heat dissipation.

The ATS-14C-42-C2-R0 is designed to dissipate heat from the system components such as CPUs, GPUs, and other components. It is not only used for processors, but can also be used to cool high-end graphics cards and even high-powered motherboards. This type of heat sink is designed to be used in air-cooled as well as liquid-cooled systems. The main advantage of a heat sink is that it will keep components at optimum temperatures, which helps them perform better and last longer than components in an overheated environment. Additionally, using a heat sink can lower the overall system temperature and ensure that components don’t get too hot, which can help reduce the risk of fire or other damaging situations.

The working principle of the ATS-14C-42-C2-R0 is quite simple. Heat is generated by the components while they are running, and is transferred to the heat sink through air or liquid convection. The heat sink fin assembly then dissipates the heat to the surrounding air, cooling the system. The fan attached to the heat sink helps to increase air circulation around the heat sink, which increases cooling efficiency. Additionally, if the system is liquid-cooled, the fan can be used to blow air across the fins of the heat sink to help reduce radiator temperature by increasing the amount of air passing over the fins.

The ATS-14C-42-C2-R0 thermal-heat sink is effective in dissipating heat from the system and can be used in air-cooled or liquid-cooled systems. It is a cost-effective cooling solution and is designed to keep components running at optimum temperatures. By dissipating heat more effectively than traditional air-cooled solutions, this type of heat sink can reduce the risk of fire or other damaged components due to overheating.

The specific data is subject to PDF, and the above content is for reference

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