| Allicdata Part #: | ATS-14D-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-14D-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14D-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal Heat Sinks are devices used to dissipate heat from an electronic component, or any other type of device which generates a large amount of heat. Heat sinks come in various shapes and sizes, depending on the application. The ATS-14D-10-C1-R0 is a thermally efficient heat sink made with aluminum and designed specifically for high-speed applications. This type of heat sink provides excellent thermal performance, as well as a low profile design that provides clearances for adjacent components.
The ATS-14D-10-C1-R0 is designed to be mounted directly on the PCB and requires no additional mounting hardware. This heat sink is ideal for applications involving high-power components where fast heat dissipation is needed. It is suitable for exposed pads and SMDs, including QFPs, SOICs, and TSOPs. The heat sink can dissipate up to 5.3W. It is also compatible with lead-free solder.
The ATS-14D-10-C1-R0 features a low profile design which makes it ideal for applications which require limited space. The design also ensures that the airflow surrounding the component is adequate to dissipate the heat quickly and efficiently. The heat sink is also designed to reduce air turbulence and noise, as it features air damper technology. This helps to reduce unwanted noise which could interfere with signals.
The ATS-14D-10-C1-R0 also features a unique thermal management design which utilizes a combination of fins, pins, and a copper base to increase surface area and improve heat dissipation. The fins help to increase the surface area so that more heat can be transferred away from the component. The pins penetrate deep into the heat sink which helps to reduce air resistance, allowing for increased air flow and improved thermal performance. The copper base helps to conduct the heat away from the component and into the heat sink where it can be dissipated.
The ATS-14D-10-C1-R0 is designed for peak performance in applications that require low profile heat sinks and efficient cooling. This heat sink offers excellent performance in high-speed applications, thanks to its unique design and efficient thermal management. Its low profile design ensures compatibility and clearances with adjacent components, while its efficient dissipation of heat ensures long-term reliability and performance. The ATS-14D-10-C1-R0 is an efficient and reliable solution for any high-speed application where heat dissipation is key.
The specific data is subject to PDF, and the above content is for reference