ATS-14D-10-C2-R0

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Thermal - Heat Sinks are a critical component of the heated thermal management system of a variety of electrical and electronic products. The ATS-14D-10-C2-R0 heat sink is designed to provide effective thermal management for a range of applications. In this article, we will discuss the application field and working principle of this heat sink.

The ATS-14D-10-C2-R0 thermal management system is designed to work on projects ranging from electronics appliances, cellular modems, and LED lighting to medical equipment, drives, motors controls, and more. It is designed to provide efficient and reliable heat transfer from electrical and electronic products. This heat sink features a copper base that provides excellent thermal conductivity, a 10mm profile height, and dimensions of 14 x 10 x 63.3mm.

The heat sink’s profile is designed to allow for easier integration into other parts of the system, as well as allowing for easier mounting onto the board. Additionally, this thermal management system features an annular groove design that helps reduce surface tension and improve thermal performance. The groove also increases the surface area to facilitate faster heat transfer.

In terms of the actual working principle of the ATS14D-10-C2-R0, the heat sink consists of a combination of two materials, a copper base and a thermally conductive adhesive. The copper base has been designed to provide excellent thermal conductivity, whereas the thermally conductive adhesive offers great adhesion and helps to transfer heat away from electronic components to the heatsink.

The heat sink is copper-clad and uses heat pipes to actively transfer the heat away from the components. The heat pipes are filled with a liquid coolant, which is then guided up the grooves in the heat sink and away from the product. The heat pipes are then cooled to dissipate the heat, transferring it away from the product. This process ensures that the product remains cool and functioning optimally.

The ATS-14D-10-C2-R0 thermal management system is designed to meet the highest industrial standards for performance and reliability. Thanks to the combination of copper and thermally conductive adhesive, the heat sink can provide efficient cooling and fast heat transfer. Additionally, its grooved design helps reduce surface tension and improve thermal performance, making it perfect for a variety of applications where cooling is necessary.

To ensure that the ATS-14D-10-C2-R0 thermal management system can provide effective cooling, it is important to ensure that the heat pipe is correctly filled with the correct coolant and correctly installed and mounted. Additionally, it is important to ensure that the design of the heat sink is appropriate for the application and that the components are appropriately sized and spaced. With the correct installation and use, the ATS-14D-10-C2-R0 thermal management system can provide fast and efficient heat transfer and cooling for your application.

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