ATS-14D-117-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-14D-117-C1-R0-ND

Manufacturer Part#:

ATS-14D-117-C1-R0

Price: $ 3.09
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14D-117-C1-R0 datasheetATS-14D-117-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.78208
30 +: $ 2.70669
50 +: $ 2.55629
100 +: $ 2.40591
250 +: $ 2.25553
500 +: $ 2.18034
1000 +: $ 1.95479
Stock 1000Can Ship Immediately
$ 3.09
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical in modern electrical and electronic systems. Heat can reduce efficiency, limit performance and can even cause physical damage to products and processes. Effective thermal management with heat sinks ensures that the necessary heat is dissipated while maintaining optimal conditions in the system and prolonging the life of the product.

The ATS-14D-117-C1-R0 is a type of heat sink designed to keep components cool and functioning optimally under high temperatures. This specialized fanless heat sink is made with the most innovative aluminum construction and features a large heat dissipating area. With dimensions of 14 inches and a weight of 8 lbs., this heat sink is perfect for most applications.

The ATS-14D-117-C1-R0 heat sink has been designed for both forced-air and conduction-based applications. The fanless construction of the product combined with its efficient heat transfer surface allow it to work up to temperatures of up to 200°C with no active cooling in either convection-based or forced-air applications. The high heat dissipation capacity of the product, combined with its large surface area, make it suitable for many applications.

In forced-air applications, the ATS-14D-117-C1-R0 is specifically designed for optimal cooling efficiency. With its wide range of mounting options, the product can be installed and removed easily from the system. Additionally, the high power capacity of the device allows it to deliver powerful cooling performance. The product is ideal for applications where ambient temperatures can exceed 200°C.

In conduction-based applications, the ATS-14D-117-C1-R0 is designed with a combination of thermally conductive materials that act as heat carriers and deliver optimal heat dissipation. The heat sink also features a combination of lamination and floating mount which enables it to deliver increased performance in system configurations where air-flow is limited. The combination of thermally conductive material and floating mount also reduces the stress on the components by relieving them from unequal pressure.

The ATS-14D-117-C1-R0 is an ideal thermal management solution for both convection- and forced-air-based applications. With its efficient heat dissipating surface, powerful cooling capability, and reliable construction, the product is an ideal choice for reducing component temperatures, maintaining productivity, and prolonging the lifetime of components even under intense working conditions.

The specific data is subject to PDF, and the above content is for reference

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