| Allicdata Part #: | ATS-14D-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-14D-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14D-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions such as heat sinks are used to actively manage the heat created by electronic components in both commercial and industrial environments. One such solution is the ATS-14D-12-C3-R0, a heat sink designed to meet the thermal requirements of a variety of applications. In this article, we will explore the application field and working principle of the ATS-14D-12-C3-R0 heat sink in greater detail.
Application Field
The ATS-14D-12-C3-R0 heat sink can be used in a number of applications where thermal management is required. The device is particularly effective in power electronics and semiconductor applications, as its unique design is tailored to dissipate large amounts of heat over a wide range of temperatures. The ATS-14D-12-C3-R0 can also be used in automotive, medical, and industrial applications, making it ideal for a range of projects.
Working Principle
The ATS-14D-12-C3-R0 heat sink operates in a simple, yet effective way. It is designed to accept and dissipate heat generated by the components in a system. This is achieved by the sink\'s fins, which are spread out over a wide area, allowing the heat to be effectively transferred away from the component in question. The heat is then distributed evenly across the fins, dissipating it to the surrounding environment. The sink also contains a thermal compound, which further aids in the heat transfer process, as well as providing a strong thermal bond between the heat source (component) and the heat sink.
The ATS-14D-12-C3-R0 heat sink also contains a number of other features. It uses an extruded aluminum baseplate, which is highly effective at absorbing and dissipating heat. The device also incorporates a low-noise fan for increased cooling performance, and a clip-on configuration, making it easy to install and remove when necessary.
Conclusion
The ATS-14D-12-C3-R0 heat sink is a versatile and highly effective solution for the thermal management of various electronic devices. It can be used in a variety of applications including power electronics, automotive, medical and industrial projects. Working on the principle of dissipating heat away from components, the sink features an efficient fin design, thermal compound and low-noise fan for increased cooling performance. With its clip-on configuration, the ATS-14D-12-C3-R0 is easy to install and remove when necessary, making it a reliable and stable choice for any application.
The specific data is subject to PDF, and the above content is for reference