ATS-14D-129-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.64°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
ATS-14D-129-C1-R0 is a type of heat sink that is used for cooling various types of components. Heat sinks are devices that dissipate heat from components by conducting it away from a source, either by direct contact or by using air convection. Heat sinks are commonly used in computers and electronics to improve the efficiency and reliability of components, and in extreme cases, prevent damage or destruction of the component. In this article, we will look at the application field and working principle of ATS- 14D-129-C1-R0 in-depth.
Thermal-Heat Sinks
Heat sinks are used to dissipate heat from components, such as processors and voltage regulating modules (VRMs), which can become very hot during operation. Heat sinks typically are made of metal and have a thermal conductive layer, such as aluminum or copper, to efficiently conduct heat away from a component. Heat sinks can be in the form of passive or active components. Passive heat sinks are designed to dissipate heat from components without additional sources of energy, whereas active heat sinks are designed with fans or other forms of air cooling to actively draw heat away from the component. The ATS-14D-129-C1-R0 thermal-heat sink is a passive heat sink, which means it does not need additional energy sources to remove heat from components.
Application Field
The ATS-14D-129-C1-R0 thermal-heat sink is designed for components that are rated up to 14 watts, such as microprocessors, VRMs, and integrated circuits (ICs). This heat sink is also ideal for applications that require high thermal efficiency but are limited in space, such as 1U or 2U servers, as its dimensions are 85 mm x 45 mm x 13.4 mm. ATS-14D-129-C1-R0 is a lightweight heat sink, weighing only 17.2 grams, which allows it to easily fit into small spaces. This heat sink has been tested and certified to meet many industry standards, including RoHS, UL, and J leads, making it a safe and reliable choice for cooling components.
Working Principle
The ATS-14D-129-C1-R0 thermal-heat sink operates by conducting heat away from components via a thermal conductive layer. The heat is first conducted by the heat sink, which is then dissipated into the surrounding air. The heat sink is designed to maximize this conductive dissipation process by using an innovative fin design. The fins are designed to create a larger surface area for air to constantly flow through, allowing it to quickly and efficiently remove heat while maintaining a low profile. The shape and size of the fins also help direct airflow for better cooling performance. Additionally, the heat sink is equipped with rubber washers to provide a tight fit when mounted.
Conclusion
The ATS-14D-129-C1-R0 is a passive thermal-heat sink designed to dissipate heat from various components while requiring very little space. Its innovative fin design and lightweight construction make it an ideal choice for both 1U and 2U servers. The heat sink is certified to meet multiple industry standards, ensuring its reliability and safety. By using this heat sink, components can be cooled efficiently and maintain optimal performance over time.

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