ATS-14D-139-C1-R0

Heat sinks are devices engineered to effectively transfer heat from a device, such as an electronics component, to the surrounding environment. This is done in order to keep the device within its specified optimum operating temperature. The ATS-14D-139-C1-R0 heat sink is a type of passive cooling component used in fanless applications and, with its aluminum frame and large profile, ensures a high performance cooling of large power electronics.

The ATS-14D-139-C1-R0 is designed for an efficient heat transfer to the atmosphere. This is achieved through its large aluminum frame and high number of fins, which increases the surface area of the sink by a large degree. The aluminum frame is designed to act as a heat spreader, responsible dispersing the heat dissipated by the component, thus allowing the fins to do the final heat transfer job with efficiency. The fins are responsible for dissipating the heat from the component, by providing an increased surface area with which to conduct radiation.

The shape of the ATS-14D-139-C1-R0 allows for a significant increase in air convection. The big profile and large area of the fins creates an ideal condition for air convection, which facilitates the natural circulation of air and keeps the component at a stable temperature, even when placed and operated in an environment with low air circulation. This is particularly useful for fanless applications, where air circulation is almost non-existent, and devices need to be kept at a stable temperature without adding a fan to the application.

The ATS-14D-139-C1-R0 is also designed to eliminate hotspots. Heat sinks traditionally feature cold spots and hot spots across the sink due to a variety of factors, ranging from imperfect designs to tolerances of materials. By the careful design of its noise-absorbent frame and homogeneously spaced fins, the ATS-14D-139-C1-R0 removes hotspots, ensuring an even temperature distribution across the sink. This further increases the performance of the sink, and in turn, helps dissipate heat better and faster from the component.

Furthermore, with its precision tolerance, the ATS-14D-139-C1-R0 manages to achieve a tight gap between the die and the interface material, thus allowing for optimal contact between the two with minimal losses. This tight gap also acts as an isolator, introducing a thermal barrier between the die and interface material to reduce thermal conduction losses, which allows for better temperature control and improved performance.

The ATS-14D-139-C1-R0 offers a variety of advantages, making it an ideal product for a range of applications, from fanless systems to industrial applications. With its efficient design to increase heat exchange, eliminate hotspots, reduce losses, and provide an even temperature distribution, the ATS-14D-139-C1-R0 is the ideal heat sink for large power electronic components.