ATS-14D-183-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-14D-183-C3-R0-ND

Manufacturer Part#:

ATS-14D-183-C3-R0

Price: $ 4.08
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14D-183-C3-R0 datasheetATS-14D-183-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.71322
30 +: $ 3.50658
50 +: $ 3.30044
100 +: $ 3.09412
250 +: $ 2.88784
500 +: $ 2.68157
1000 +: $ 2.63000
Stock 1000Can Ship Immediately
$ 4.08
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.47°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are typically used to dissipate the generated heat from components and other devices by taking the heat away from the body and transferring it into the surrounding environment. An ATS-14D-183-C3-R0 is one such Thermal - Heat Sink.

The ATS-14D-183-C3-R0 is a thermally optimized aluminum heat sink with an attached fan. The heat sink has a superior thermal conductivity which ensures efficient heat transfer. It also features a variety of features such as an exposed area that is optimized for a low-Noise optimized fan operation. Additionally, its light weight also helps in optimizing the usage of space in the application.

The thermal-heat sinks from ATS-14D-183-C3-R0 has a wide range of applications in various industries. It can be used in the automotive industry, telecommunications systems, electronic devices such as computers and laptops, industrial machinery, aerospace and aviation equipment, and many other fields.

The working principle of the ATS-14D-183-C3-R0 is based on transferring heat from the body of the device to the heat sink. This transfer occurs as a result of the convective heat transfer mechanism. This means that the heat is transferred from one side of the device to the other side (the heat sink) by the air surrounding it. The higher the temperature difference between the device and the heat sink, the faster and more efficient the heat transfer is.

In order to optimize the performance of the ATS-14D-183-C3-R0 Thermal - Heat Sink, it is important to select the right type of heat sink and to install it properly. Furthermore, the fan should be selected that is capable of efficiently cooling the heat sink and the device it is cooling. The orientation of the fan should be such that it is focused on the heat sink for maximum output.

In addition to the main application of dissipating heat, the ATS-14D-183-C3-R0 Thermal - Heat Sink can also be used to reduce the risk of electrical fire. If the device has temperature-sensitive components, a heat sink can be used to reduce the chance of a fire potentially occurring. Another useful application for thermal-heat sinks is the heat dissipation from electronic devices such as mobile phones, digital cameras and laptops.

The ATS-14D-183-C3-R0 thermal-heat sink is an efficient and reliable heat transfer solution ideal for a wide range of applications. Its lightweight construction, superior thermal conductivity and low-noise fan operation make it a great choice for the majority of thermal-heat sink applications.

The specific data is subject to PDF, and the above content is for reference

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