| Allicdata Part #: | ATS-14D-185-C3-R0-ND |
| Manufacturer Part#: |
ATS-14D-185-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14D-185-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components of any modern electronics enclosure. As the name suggests, they are designed to dissipate the heat generated by components. Heat sinks are commonly used in many applications, such as computers, data centers, and industrial equipment. The ATS-14D-185-C3-R0 is a high performance, compact heat sink designed specifically for thermal management in demanding applications.
The ATS-14D-185-C3-R0 features a unique fin-shaped profile with a fin pitch of 0.2mm. This fin pitch provides increased heat transfer compared to other, larger heat sinks. The heat sink is designed with a base plate made of high quality aluminum alloy and has a black anodized or natural finish. The fin pitch, along with the presence of a diffuser and top hat, also helps to reduce the overall size of the heat sink. The thermal engineering of the ATS-14D-185-C3-R0 has been optimized for high power components. As a result, this heat sink has a superior thermal performance, which is important for certain demanding applications.
The ATS-14D-185-C3-R0 heat sink is designed for a wide variety of applications. The heat sink can be used in applications such as power amplifiers, servers, LED lighting, microprocessors, and embedded devices. It is also suitable for automotive applications where thermal management is critical. The heat sink is designed with multiple mounting options, making it easier to integrate into various applications.
In terms of working principle, the ATS-14D-185-C3-R0 uses natural convection to create an airflow that carries away excessive heat generated by components. This airflow is created by the fin-shaped profile of the heat sink, which helps to efficiently dissipate heat as the air passes over the surface of the fins. The presence of a diffuser and top hat further increases the airflow and improves the thermal efficiency of the heat sink. Additionally, the fin-shaped profile also helps to reduce the overall size of the heat sink and facilitates mounting.
The ATS-14D-185-C3-R0 is an excellent example of a high performance, compact heat sink. The unique design and fin pitch of the heat sink provide superior thermal performance, making it ideal for a wide range of applications. The multiple mounting options also make it easier to integrate into various applications. With its superior thermal efficiency and multiple mounting options, the ATS-14D-185-C3-R0 is an excellent choice for thermal management in demanding applications.
The specific data is subject to PDF, and the above content is for reference