| Allicdata Part #: | ATS-14D-200-C1-R0-ND |
| Manufacturer Part#: |
ATS-14D-200-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14D-200-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions such as heat sinks are important for maintaining reliable and efficient electronic components. The ATS-14D-200-C1-R0 is a thermal-manageable heat sink designed for an extremely wide range of applications. By utilizing a combination of features such as its lightweight design and special heat-sink coating, the ATS-14D-200-C1-R0 can provide exceptional performance in applications with high thermal loads.
Application Field of ATS-14D-200-C1-R0
The ATS-14D-200-C1-R0 can be used in a variety of applications, ranging from computers and consumer electronics to industrial equipment and even medical devices. This versatile heat sink is highly suitable for a range of applications including high current loads, hard-to-cool components, and high-temperature environments. As a result, the ATS-14D-200-C1-R0 is an ideal solution for managing thermal loads in a wide variety of applications.
The ATS-14D-200-C1-R0 is designed to handle high current loads with ease. Its unique design features allow it to be used in applications with up to 40A of current draw, while maintaining a low thermal impedance. This makes the heat sink suitable for a variety of electronics, including consumer electronics, portable instrumentation, and industrial power supplies.
In addition, the ATS-14D-200-C1-R0 is constructed with a lightweight, low-profile design that makes it easy to install in both large and small form factor devices. This feature allows the heat sink to be used in a range of applications without taking up too much valuable space. Furthermore, the ATS-14D-200-C1-R0 is also designed with a special heat-sink coating which improves its heat dissipation efficiency.
The ATS-14D-200-C1-R0 is a versatile heat sink that provides exceptional performance in a wide range of applications. With its lightweight design and special heat-sink coating, this thermal management solution offers superior thermal transfer and excellent heat dissipation. As a result, it is perfectly suited for managing high thermal loads and reducing overall system temperatures.
Working Principle of ATS-14D-200-C1-R0
The ATS-14D-200-C1-R0 works by dissipating heat away from the device it is attached to. This is achieved by transferring the heat from the component to the thermal mass of the heat sink\'s finned structure. The fins of the ATS-14D-200-C1-R0 provide increased surface area, allowing more efficient heat transfer. The fins then disperse the heat into the surrounding environment.
The ATS-14D-200-C1-R0 also utilizes a special heat-sink coating, which further improves its heat transfer and dissipation capabilities. This coating is designed to increase thermal conductivity and provide enhanced heat dissipation. This feature allows the ATS-14D-200-C1-R0 to operate in high-temperature environments without compromising performance.
In addition, the ATS-14D-200-C1-R0 heat sink also features an innovative design which improves thermal transfer. This includes its lightweight and low-profile design, as well as its unique spring-clip mounting system. This spring-clip mounting system allows for easy installation and secure attachment to the device.
Overall, the ATS-14D-200-C1-R0 heat sink offers an efficient and reliable solution for managing thermal loads. By using a combination of its lightweight design, special heat-sink coating, and innovative mounting system, the ATS-14D-200-C1-R0 can provide exceptional thermal transfer and efficient heat dissipation in applications with high thermal loads.
The specific data is subject to PDF, and the above content is for reference