ATS-14D-203-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.04°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-14D-203-C3-R0 application field and working principle

Heat sinks are an important part of the thermal management and cooling of electronic systems. A heat sink is a heat exchange device that serves to absorb thermal energy from a component, and then dissipate such energy to its surrounding environment, usually through thermal radiation and convection. Heat sinks are commonly used to help regulate circuit board operating temperatures and prolong the life of components, or to dissipate generated heat away from sensitive components, such as integrated circuits and transistors. The ATS-14D-203-C3-R0 is a CPU heat sink with 4-pin PMW fan specifically designed for cooling processors. It has a fan speed of 2500 RPM, great fins and an aluminum base, this heat sink unit is an excellent product for reaching optimal temperatures. It has a maximum power rating of 6.6 watts and a minimum speed of 1600 RPM when operated from a 12VDC power source. Additionally, the ATS-14D-203-C3-R0 is designed for motherboards providing a 3-Pin motherboard connection and comes with rubber lug attachment points so that it can secure to the chassis.The thermal flow of the ATS-14D-203-C3-R0 is generated using three major components: fins, base, and fan. The fins are extruded aluminum sheets bent into a U shape which sit atop the base. The fins also provide additional surface area which allows the heat sink to absorb and dissipate heat quicker than a single heat-absorbent material. For a CPU, the base is made of aluminum or copper and the fan sucks in air which cools the base and fins before being pushed out of the system.The ATS-14D-203-C3-R0 application field is ideal for motherboard chipsets, graphics chips, CPUs, and other components that require a higher level of heat dissipation. Additionally, due to its fan speed and fan size, it fits well in all cases. The ATS-14D-203-C3-R0\'s working principle involves adjustment of the temperature of the processed component by use of a fans in combination with a large heat sink area. Using this combination, the air passes through the fans and is forced over the heat sink, causing the heated process component to remain cool by dissipating heat with a forced air of air past the heat sink. In addition to the features previously mentioned the ATS-14D-203-C3-R0 has an airflow of 59 CFM with a noise level of only 18dBA. It also boasts a significant level of air pressure capacity (up to 2.3 mm H2O) and has a latent heat capacity of 205W. Furthermore, the dimensions of the ATS-14D-203-C3-R0 is 99 X 76 X 41 mm (W x L x H). The ATS-14D-203-C3-R0 is an all-round great heat sink solution for any processor applications. The large high-airflow fan with PWM technology, coupled with the large heat sink fin array produces an effective cooling capacity that will limit over-heating and extend the life of the processor it is cooling. The ATS-14D-203-C3-R0 is one of the most popular CPU heatsinks on the market today, owing to its excellent cooling ability and easy of installation. Potential users of this thermal product should consider its application field and working principle in order to achieve the best results.

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