| Allicdata Part #: | ATS-14D-209-C1-R0-ND |
| Manufacturer Part#: |
ATS-14D-209-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14D-209-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are an important technology used to reduce the amount of heat produced by electronic components. ATS-14D-209-C1-R0 is a Thermal Heat Sink that is designed for use in cooling a variety of electronic components. This article will discuss the application field and working principle of ATS-14D-209-C1-R0.
ATS-14D-209-C1-R0 is a high-performance Heat Sink designed to provide excellent heat dissipation for a wide variety of electrical components. It is composed of an aluminum base with grooves and fins, copper pipes, and a patented conduction compound to provide maximum thermal efficiency. ATS-14D-209-C1-R0 is designed for cooling components that generate high thermal flux such as LEDs, CPUs, GPUs, FPGAs, and cell phone processors. It can also be used to cool power supplies in industrial machines and personal computers.
The working principle of ATS-14D-209-C1-R0 is based on the three-stage heat transfer process. First, the thermal flux generated by the electrical components is absorbed by the aluminum base of the thermal heat sink and conducted into the fins. Second, the heat absorbed is radiated and convected away from the fins by the air flow generated by a fan or other cooling device. Finally, the cooled air is absorbed and dissipated into the environment.
ATS-14D-209-C1-R0\'s efficient thermal design allows for the cooling of sensitive components operating at higher temperatures. Its aluminum base helps to reduce the intensity of heat produced by the electronic components, while its copper pipes help dissipate heat more quickly and reduce the amount of air flow needed to cool the components. The advanced conduction compound technology used in the Thermal Heat Sink spreads the heat evenly across the entire base, ensuring that the heat transfer process is efficient and effective.
In conclusion, ATS-14D-209-C1-R0 is a high-performance Thermal Heat Sink designed to provide excellent cooling for a variety of electrical components. Its efficient thermal design makes it ideal for use in cooling components operating at high temperatures. By utilizing the three-stage heat transfer process, ATS-14D-209-C1-R0 is able to effectively dissipate heat into the environment and keep the components running at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference