ATS-14D-32-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	21.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal-heat sinks are used in a variety of applications to dissipate heat generated by electrical components, such as CPUs, transistors, and amplifier circuits. A thermal-heat sink is a metal structure with a heat conductive surface that is designed to dissipate heat away from an electrical component. Heat is dissipated by either conduction or radiation. Heat sinks work by transferring the heat away from the components and out into the environment using passive cooling, thermoelectric cooling, and/or forced air convection.The design of thermal-heat sink systems varies depending on their application. Generally, heat sinks are made from metal, either aluminum or copper, which provide good thermal conductivity. Heat sinks are designed in a multitude of shapes and sizes to accommodate the size of the component, and the amount of heat that must be dissipated. There are several types of common coolers used for thermal-heat sink systems, such as active, passive, and water-cooled systems.

Application Field of ATS-14D-32-C2-R0 and Working Principle

The ATS-14D-32-C2-R0 is a thermal-heat sink that is designed to dissipate heat generated by high-powered electrical components such as CPUs and transistors. This heat sink is made of high-grade aluminum and features a finned surface that is designed to increase the surface area and thus dissipate heat efficiently.In operation, the ATS-14D-32-C2-R0 is attached to the component that is generating heat. The heat generated by the component is transferred to the heat sink, either via direct conduction or through radiation. The aluminum fins on the heat sink absorb the heat, which is then dissipated into the environment via convection. The large surface area of the fins allows for greater heat dissipation, keeping the electrical component cooler.The ATS-14D-32-C2-R0 is a highly efficient heat-sink, and is designed to work in a variety of applications. It is suitable for use in high-powered electronics such as CPUs and transistors, as well as amplifiers and other high-power components. The ATS-14D-32-C2-R0 is also suitable for applications where space is limited, as its slim design makes it ideal for use in compact electrical enclosures and computer cases. The thermal-heat sink is also highly efficient in dissipating heat quickly and efficiently.

Conclusion

The ATS-14D-32-C2-R0 is a highly efficient thermal-heat sink designed to dissipate heat generated by high-powered electronics. It is made of high-grade aluminum and features a finned surface that is designed to increase the surface area and thus dissipate heat efficiently. The ATS-14D-32-C2-R0 is suitable for use in a variety of applications, and is highly efficient in dissipating heat quickly and efficiently.

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