| Allicdata Part #: | ATS-14D-43-C3-R0-ND |
| Manufacturer Part#: |
ATS-14D-43-C3-R0 |
| Price: | $ 3.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14D-43-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.01959 |
| 30 +: | $ 2.93790 |
| 50 +: | $ 2.77477 |
| 100 +: | $ 2.61154 |
| 250 +: | $ 2.44831 |
| 500 +: | $ 2.36669 |
| 1000 +: | $ 2.12187 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 29.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-14D-43-C3-R0 is a thermal heat sink, a device used to dissipate heat away from electronic elements. It works by transferring thermal energy away from its heated source, like a processor or amplifier, and into an ambient cooling medium. The device’s application field is broad due to its unique design characteristics, including its ability to transfer heat over a wide temperature range. It is often found in the application fields of consumer electronics, industrial equipment, military applications and more.
The device’s working principle is fairly simple. Heat is transferred from its source, like a PCB or components, by conduction to the heat sink device. Heat is then dissipated away from the source to a location with lower temperature, such as the atmosphere, through convection. The thermal transfer process is facilitated by the device’s higher thermal conductivity as compared to air. It is also aided by the thermal mass of the material, and the surface area of the device.
The ATS-14D-43-C3-R0 comes in two varieties: active and passive. The active types are electrically powered, and can maintain a specified temperature regardless of the ambient temperature. The passive types are not electrically powered, and have to rely on active cooling methods like fans to dissipate heat away from its source. Regardless of type, the device’s two primary areas of application are in the military and industrial markets, although it’s gaining popularity in consumer electronics as well.
The device’s application field revolves around its ability to dissipate and transfer heat over a wide temperature range. It’s often found in devices that require high levels of power, such as power amplifiers, processors, and other high-end electronics. Its unique designs also make it a viable choice for applications where space is limited. Some types of active heat sinks can reach temperatures up to 100°C, while passive models can reach up to 200°C.
The ATS-14D-43-C3-R0 thermal heat sink is a highly efficient and versatile device. Its ability to dissipate and transfer heat over a wide temperature range makes it a suitable choice for both military and industrial applications. Given its affordability and widespread availability, it’s become a popular choice for consumer electronics as well. Ultimately, it’s a great choice for any application that requires both cooling efficiency and low cost.
The specific data is subject to PDF, and the above content is for reference