Allicdata Part #: | ATS-14E-10-C3-R0-ND |
Manufacturer Part#: |
ATS-14E-10-C3-R0 |
Price: | $ 3.93 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-14E-10-C3-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.57399 |
30 +: | $ 3.37554 |
50 +: | $ 3.17696 |
100 +: | $ 2.97845 |
250 +: | $ 2.77989 |
500 +: | $ 2.58133 |
1000 +: | $ 2.53168 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal solutions, such as heat sinks, are widely used for many electronic devices and components. The ATS-14E-10-C3-R0 is a thermal solution specialized for cooling components. It is a high-performance heat sink that is specifically designed to disperse accumulated heat from industrial components. It is widely used in a variety of applications.
The ATS-14E-10-C3-R0 consists of an anodized aluminium base, a dielectric layer, and 4 copper fins. The copper fins act as a heat sink, which thermally transfers heat away from sensitive components while the dielectric layer helps to protect the components from over-heating. The anodized aluminium base allows the heat sink to be mounted to the component being cooled. This thermal solution has an impressive thermal resistance of 0.18 K/W, resulting in superior cooling performance.
The ATS-14E-10-C3-R0 provides a wide range of applications — from industrial control equipment and high-end server systems, to LED lighting, medical imaging systems, and security equipment. It is designed to be used for cooling printed circuit boards, high-power semiconductor components, power supplies, and various other components used in electronic devices and systems. It is a great choice for applications where increased surface area is required to efficiently dissipate heat.
The ATS-14E-10-C3-R0 is very easy to use and install. It comes pre-assembled with pre-applied thermal transfer paste, making installation a breeze. It is also designed to be resistant to vibration and shock, ensuring reliable cooling performance in the most demanding environments. The heat sink is also compatible with a variety of mounting options, making it suitable for virtually any application.
The ATS-14E-10-C3-R0 is specifically designed for use in high-performance electronics and industrial control systems. Its superior thermal properties makes it an ideal solution for applications where efficient cooling is needed. Its simple and hassle-free installation make it a great option for any application.
The specific data is subject to PDF, and the above content is for reference