ATS-14E-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-14E-10-C3-R0-ND

Manufacturer Part#:

ATS-14E-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14E-10-C3-R0 datasheetATS-14E-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions, such as heat sinks, are widely used for many electronic devices and components. The ATS-14E-10-C3-R0 is a thermal solution specialized for cooling components. It is a high-performance heat sink that is specifically designed to disperse accumulated heat from industrial components. It is widely used in a variety of applications.

The ATS-14E-10-C3-R0 consists of an anodized aluminium base, a dielectric layer, and 4 copper fins. The copper fins act as a heat sink, which thermally transfers heat away from sensitive components while the dielectric layer helps to protect the components from over-heating. The anodized aluminium base allows the heat sink to be mounted to the component being cooled. This thermal solution has an impressive thermal resistance of 0.18 K/W, resulting in superior cooling performance.

The ATS-14E-10-C3-R0 provides a wide range of applications — from industrial control equipment and high-end server systems, to LED lighting, medical imaging systems, and security equipment. It is designed to be used for cooling printed circuit boards, high-power semiconductor components, power supplies, and various other components used in electronic devices and systems. It is a great choice for applications where increased surface area is required to efficiently dissipate heat.

The ATS-14E-10-C3-R0 is very easy to use and install. It comes pre-assembled with pre-applied thermal transfer paste, making installation a breeze. It is also designed to be resistant to vibration and shock, ensuring reliable cooling performance in the most demanding environments. The heat sink is also compatible with a variety of mounting options, making it suitable for virtually any application.

The ATS-14E-10-C3-R0 is specifically designed for use in high-performance electronics and industrial control systems. Its superior thermal properties makes it an ideal solution for applications where efficient cooling is needed. Its simple and hassle-free installation make it a great option for any application.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics