ATS-14E-138-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-14E-138-C1-R0-ND

Manufacturer Part#:

ATS-14E-138-C1-R0

Price: $ 3.08
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14E-138-C1-R0 datasheetATS-14E-138-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.77011
30 +: $ 2.69514
50 +: $ 2.54533
100 +: $ 2.39564
250 +: $ 2.24590
500 +: $ 2.17103
1000 +: $ 1.94643
Stock 1000Can Ship Immediately
$ 3.08
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.12°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components used in many applications. The ATS-14E-138-C1-R0 is a type of thermal heat sink that is commonly used in power electronics applications. In this article, we will cover the application field and working principle of the ATS-14E-138-C1-R0.

The ATS-14E-138-C1-R0 is a highly efficient, reliable and cost-effective heat sink which is suitable for a variety of applications. The thermal design is quite compact and lightweight, making it suitable for many applications in the field of power electronics. The heat sink is designed to dissipate heat from the components in an efficient and timely fashion. This helps to extend the life of the components and protect them from excessive heat build up.

The main application of the ATS-14E-138-C1-R0 is in the field of power electronics. The heat sink is designed to dissipate high thermal loads, making it highly suitable for use in power resistors, diodes, transistors, MOSFETs, and IGBTs. It is also used in power converters, power processors, and other electronic systems subject to high thermal loads. Because of its compact design, the ATS-14E-138-C1-R0 is also suitable for use in applications where space is limited.

The working principle of the ATS-14E-138-C1-R0 is based on the principles of conductive and convective heat transfer. The heat sink consists of a base and fins which are designed to dissipate heat away from the components. The fins provide a large surface area which helps to increase the rate of heat dissipation. Heat is transferred from the components to the base and then to the fins. As the fins are exposed to air, the air molecules help to absorb and dissipate the heat away from the components.

In addition to these features, the ATS-14E-138-C1-R0 also has a number of other features which make it a high-performance, reliable and cost-effective option. The heat sink is resistant to corrosion and vibration, making it suitable for use in a variety of environments. It is also designed to provide efficient cooling performance, allowing the components to operate at their full potential. The heat sink is also designed to provide good thermal dissipation characteristics, making it ideal for applications with high thermal loads.

In conclusion, the ATS-14E-138-C1-R0 is a highly efficient and reliable thermal heat sink which is suitable for use in a wide range of power electronics applications. It is designed to dissipate high thermal loads and also provides excellent thermal dissipation characteristics. The ATS-14E-138-C1-R0 is also resistant to corrosion and vibration, making it ideal for use in a variety of environments.

The specific data is subject to PDF, and the above content is for reference

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