| Allicdata Part #: | ATS-14E-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-14E-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions are essential to ensure the reliability and quality of many electronic devices, increasing their efficiency as demands continue to grow. Heat sinks are one of the most efficient and widely used solutions available, and the ATS-14E-139-C1-R0 is one of the most popular heat sinks available today. In this article, we will discuss its application field and working principle.
The ATS-14E-139-C1-R0 is designed for use in heat-sensitive applications, such as medical, telecom, and information technology equipment. The product offers excellent heat dissipation due to its anodized aluminum construction, which provides excellent thermal conductivity. Moreover, this unit features an evenly distributed inner surface which provides uniform airflow and improved thermal stability. The heat sink’s design and construction ensures a reduced risk of heat-related issues and improved operational performance, which is essential for equipment safety and longevity.
The ATS-14E-139-C1-R0 works by utilizing an advanced extruded cooling technology. This technology provides a path for heat to dissipate from the microchips or other heated components. The heat sink dissipates heat faster than traditional cooling methods, such as fans and heat pipes. Its anodized aluminum construction allows for excellent heat transfer, while its design ensures that maximum amounts of heat can be quickly pulled away from the components, improving equipment lifespan. In addition, its unique design allows for maximum efficiency, thus reducing energy costs.
The ATS-14E-139-C1-R0 is a highly efficient and cost-effective thermal management solution for heat-sensitive applications. This product provides excellent thermal conductivity and uniform airflow that helps reduce the risk of heat-related issues and improves the performance of equipment. In addition, the advanced extruded cooling technology of this product ensures maximum efficiency and reduced energy costs.
In summary, thermal management solutions are necessary to improve the efficiency and reliability of electronic devices. The ATS-14E-139-C1-R0 heat sink is designed to meet the heat-sensitive applications, providing excellent thermal conductivity and uniform airflow. This product utilizes an advanced extruded cooling technology that ensures maximum efficiency and reduced energy costs. It is an essential part of heat dissipating solutions, helping to bring your equipment’s performance to its full potential.
The specific data is subject to PDF, and the above content is for reference