| Allicdata Part #: | ATS-14E-169-C3-R0-ND |
| Manufacturer Part#: |
ATS-14E-169-C3-R0 |
| Price: | $ 3.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-169-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.24576 |
| 30 +: | $ 3.15777 |
| 50 +: | $ 2.98229 |
| 100 +: | $ 2.80690 |
| 250 +: | $ 2.63146 |
| 500 +: | $ 2.54374 |
| 1000 +: | $ 2.28059 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to Thermal – Heat Sinks And The ATS-14E-169-C3-R0
Thermal – heat sinks are a type of cooling device that help dissipate large amounts of heat produced by electronics and other systems. These systems often run at high temperatures, which can have a significant impact on their performance as well as their longevity. Heat sinks are designed to help disperse the heat and maintain the temperature of the components within a given range. The ATS-14E-169-C3-R0 is a specific model of thermal – heat sink designed for specialized applications.
Application Field
The ATS-14E-169-C3-R0 is designed for use in high-temperature environments, such as those found in data centers or other large-scale operations. It is also designed for use in applications where high-quality thermal performance is essential, such as those which require heat to be effectively transferred from one area to another. This type of thermal – heat sink is ideal for large scale operations which require a reliable solution for heat management.
Design And Working Principle
The ATS-14E-169-C3-R0 is composed of a special abrasion-resistant material. The material is designed to provide a high degree of durability and long-term performance. The design of the device is optimized to ensure efficient heat transfer from the component to the ambient environment. This model features a unique extended-flow fins design for improved performance and optimized thermal conductivity. It also features a heat pipe cooling system, which is designed to maximize heat transfer from the device to the cooling medium.
The ATS-14E-169-C3-R0 is designed to be installed in a single configuration, which allows for an easy installation process and ensures a secure fit. The design also features an external heatsink to prevent the overheating of the components which are being cooled. The device is also designed to dissipate the heat effectively and efficiently, which is essential for maintaining system stability and performance in high-temperature environments.
The ATS-14E-169-C3-R0 is highly reliable and is designed to work under a wide range of operating conditions. It is capable of handling temperatures up to a maximum of 185°C. The device is designed to dissipate heat quickly and effectively, and is capable of cooling components which are exposed to high temperatures. The model is also designed to be corrosion resistant, which ensures that the device is able to perform even in the most challenging of environments.
Conclusion
The ATS-14E-169-C3-R0 is a reliable and effective thermal – heat sink designed for specialized applications. It is designed for hot electronics and high-temperature operations, and is capable of dissipating large amounts of heat with ease. The design of the device is optimized for efficiency and maximum thermal performance, and it is corrosion-resistant and resilient. The ATS-14E-169-C3-R0 is capable of handling temperatures up to a maximum of 185°C.
The specific data is subject to PDF, and the above content is for reference