ATS-14E-17-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-14E-17-C3-R0-ND

Manufacturer Part#:

ATS-14E-17-C3-R0

Price: $ 4.23
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-14E-17-C3-R0 datasheetATS-14E-17-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.80520
30 +: $ 3.59415
50 +: $ 3.38260
100 +: $ 3.17123
250 +: $ 2.95982
500 +: $ 2.74840
1000 +: $ 2.69555
Stock 1000Can Ship Immediately
$ 4.23
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.51°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-14E-17-C3-R0 is a thermal-heat sink designed for use in both industrial and commercial applications. It is a reliable, efficient, and robust cooling solution for a wide variety of industrial and commercial products and applications.

The ATS-14E-17-C3-R0 is a passive heat sink featuring an aluminum fin design that helps to disperse heat quickly and efficiently from the component being cooled. It also includes a conductive thermal pad which helps to draw heat away from the component into the fin array above. The thermal pad is important for dissipating thermal energy and preventing overheating of the component.

The ATS-14E-17-C3-R0 also utilizes an advanced two-phase heat dissipation method to ensure cooling performance. This is done by using a combination of phase change materials and phase change cooling plates. These materials enable rapid heat transfer between the component being cooled and the fins of the heat sink, resulting in maximum cooling power.

The heat resulting from the operation of the component is expelled through the base of the ATS-14E-17-C3-R0. This heat is then dispersed through the fin array via convective cooling. In addition to dispersing heat quickly, this also helps to prevent hotspots from forming in any area of the heatsink.

The ATS-14E-17-C3-R0 is designed to be installed in tight spaces without having to sacrifice on performance or durability. It is also specifically designed for use in high-temperature environments, providing cooling when temperatures reach up to around 120°C. This makes it ideal for industrial and commercial applications that require reliable cooling solutions.

In summary, the ATS-14E-17-C3-R0 is a reliable, efficient, and robust thermal-heat sink designed for use in both industrial and commercial applications. It utilizes an advanced two-phase heat dissipation method to ensure maximum cooling power, and is specifically designed for use in high-temperature environments. This makes it ideal for the cooling needs of a wide variety of industrial and commercial products and applications.

The specific data is subject to PDF, and the above content is for reference

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