ATS-14E-170-C2-R0

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Heat sinks are devices made from aluminum, copper, and other heat-dissipating materials, which are used to absorb and dissipate heat generated by electronic components. Heat sinks help keep electronic devices cool, by aiding in the transfer of heat from the device\'s components to the ambient environment by increasing the surface area in contact with the air. Thermal management is a critical part of design for any electronic device, and heat sinks are one of the most effective and reliable ways to manage thermal load.

The ATS-14E-170-C2-R0 is a high-efficiency, extended-life thermal heat sink designed for electronic components. It is constructed of a high-performance extrudable zinc-aluminum (ZA-27) alloy and is designed to provide efficient cooling with a long service life. The heat sink is also equipped with a patented Cool Max Fin System which helps dissipate heat more quickly by creating an efficient and large contact area between the fins and the component being cooled. The fins of the ATS-14E-170-C2-R0 are designed to direct both air and liquid through them for maximum cooling.

The ATS-14E-170-C2-R0 is widely used in a variety of applications, including power supplies, power converters, LED lighting, servers and CPUs, motor drives, and telecommunications systems. It is also suitable for applications with low airflows as well as high static pressures and turbulent airflows. Additionally, it is capable of handling high heat loads in tight enclosures.

The ATS-14E-170-C2-R0 is designed to work with forced or natural airflow, and can be mounted horizontally or vertically. It features curved profile fins which are designed to maximize the surface area while maintaining a low profile. The curved profile fins also create turbulence in the airflow for better heat transfer. Additionally, the patented Cool Max Fin System allows for higher airflow and reduces the impedance for better cooling performance.

The ATS-14E-170-C2-R0 is fabricated based on the principle of convection heat transfer. Convection is the process where a gas (air) or liquid is heated by a solid (heat sink). The heat from the solid is carried away by the momentum of the heated particles as they move around (convection current). As natural airflow passes through the heat sink, it carries away heat energy from its contact surface, thus cooling the device. For forced airflow, a fan is used to increase the rate of convection.

The ATS-14E-170-C2-R0 is an effective and reliable thermal heat sink that can be used in a variety of electronic devices. Its high-performance extrudable ZA-27 alloy construction and patented Cool Max Fin System improve thermal management, making it a great choice for keeping electronic components cool. With its efficient cooling capabilities, long service life, and ability to handle high heat loads, the ATS-14E-170-C2-R0 is an excellent choice for thermal management.

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