| Allicdata Part #: | ATS-14E-183-C3-R0-ND |
| Manufacturer Part#: |
ATS-14E-183-C3-R0 |
| Price: | $ 4.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-183-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.71322 |
| 30 +: | $ 3.50658 |
| 50 +: | $ 3.30044 |
| 100 +: | $ 3.09412 |
| 250 +: | $ 2.88784 |
| 500 +: | $ 2.68157 |
| 1000 +: | $ 2.63000 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.47°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential part of modern electronics. Thermal management products, like ATS-14E-183-C3-R0, are designed to dissipate heat away from sensitive electronic components. In this article, we will discuss the application field and working principle of the ATS-14E-183-C3-R0 heat sink.
The ATS-14E-183-C3-R0 is a thermal heat sink, primarily used in cooling small electronic components. It is designed to absorb and dissipate thermal energy in order to ensure the optimal performance and life of the electronics. This heat sink is most commonly used in applications such as automotive electronics, consumer electronics, medical equipment, and telecommunications.
The ATS-14E-183-C3-R0 is composed of an aluminum housing and a thermally conductive plastic core. The aluminum housing provides structural strength and rigidity, as well as improved thermal conductivity. The thermally conductive plastic core provides superior thermal dissipation, while also providing protection from short circuits and insulation. The ATS-14E-183-C3-R0 uses an innovative three-stage design which maximizes heat transfer efficiency.
In order to understand the working principle of the ATS-14E-183-C3-R0, it is important to understand thermal management principles. Heat sinks are designed to absorb heat from electronic components and dissipate it away from the components. To achieve this, the ATS-14E-183-C3-R0 utilizes a three-stage design. The first stage involves drawing heat away from the components using aluminum fins. The second stage involves cooling the air around the fins using thermal radiation. The third stage involves cooling the air using thermal conduction.
In addition to transferring thermal energy away from components, heat sinks are designed to absorb and dissipate the thermal energy. The ATS-14E-183-C3-R0 utilizes a unique combination of thermally conductive plastic and aluminum to absorb heat and dissipate it away from the components. The plastic and aluminum core also provides insulation to the heat sink, preventing short circuits. This design also minimizes the amount of space needed for installation.
The ATS-14E-183-C3-R0 is a very efficient and cost-effective solution for cooling down small electronic components. It is designed to withstand temperatures up to 105°C and offers protection for components from short circuit damage. And with its three-stage thermal management design and robust construction, the ATS-14E-183-C3-R0 is the ideal solution for cooling small electronic components.
The specific data is subject to PDF, and the above content is for reference