| Allicdata Part #: | ATS-14E-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-14E-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for many electronic devices and products. The ATS-14E-197-C1-R0 heat sink is an efficient, cost-effective device designed to store and dissipate heat generated by an electronic component or system.
This particular model is a skived, extruded aluminum heat sink that is composed of an extruded aluminum base and a set of interconnected fins, joined together to form a single unit. The aluminum extrusion consents optimal fin geometry for maximum thermal performance. The fins are also beveled to create a seamless transition between the fins and the base.
Typically, the ATS-14E-197-C1-R0 is mounted to a device using a standard push-pin clip system. It is also designed to be mounted using an optional side-clip system, if desired. The heat sink can be fastened to the device using screws, rivets, or by using a thermal adhesive.
The ATS-14E-197-C1-R0 thermal management device is an effective way to manage the heat generated by electronics. It is designed to store and dissipate heat generated by electronic components or systems. It helps to increase the overall efficiency and stability of the device or system being cooled while reducing the risk of thermal damage to components. This is particularly important for applications that are in relatively confined spaces, or in environments that may have a high ambient air temperature.
The working principle of the ATS-14E-197-C1-R0 heat sink is based on convection cooling. Heat is transferred from the surface of the heat sink through the fins and the base, and dissipated into the surrounding ambient air. Convection cooling is an efficient and cost-effective way to keep electronic components and systems running at their optimal temperature while also reducing the risk of thermal damage.
The ATS-14E-197-C1-R0 can be used in a wide variety of application fields, including medical and telecommunications equipment, computers and peripherals, audio/video amplifiers and power supplies, gaming consoles, servers and network switches, microprocessors, automotive electronics, industrial and consumer electronics and more. Additionally, the device is suitable for both indoor and outdoor use, making it a versatile heat dissipation solution.
In summary, the ATS-14E-197-C1-R0 is an effective, cost-effective and versatile heat sink device that is suitable for a variety of applications. It is designed to help manage the temperature of an electronic device or system while also reducing the risk of thermal damage. The device can be mounted using standard push-pin clips or optional side-clip systems, and its working principle is based on convection cooling.
The specific data is subject to PDF, and the above content is for reference