| Allicdata Part #: | ATS-14E-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-14E-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are an essential element of modern electronic design, used to dissipate thermal energy from the components of an electronic system and reduce the temperature in order to protect the device from damage. The ATS-14E-20-C1-R0 is a thermal heat sink, designed to provide a cost-effective, reliable solution for thermal management and cooling applications.
This heat sink provides efficient and effective cooling in tight spaces, making it an ideal choice for tight space applications, such as embedded systems or densely populated boards. It is designed for use in a wide range of applications, from high-end servers and workstations to low-end embedded systems. The ATS-14E-20-C1-R0 includes a folded fin design that provides maximum surface area for efficient heat transfer, highly improved thermal performance under extreme high-temperature conditions, and a quiet, reliable fanless solution for silent operation.
The working principle of this thermally-managed system is based on the simple concept of heat transfer. Heat from the components is quickly dissipated through the heat sink, which distributes the heat from the hot spots on the components to a larger area. This process is known as forced conduction convection and is designed to quickly and efficiently dissipate heat from the electronic components. The heat sink is constructed from high-grade aluminum and other materials to provide superior heat transfer and maximum heat dissipation.
The fanless design of the ATS-14E-20-C1-R0 makes it ideal for applications where low noise operation is desired. Additionally, it features a direct attachment manufacturing process, which allows components to be directly mounted onto the heat sink without the need for any additional mounting hardware. This reduces assembly time and cost, as well as increases the reliability of the system.
This thermal heat sink is compatible with multiple processor architectures, such as Intel® Xeon® E5, E5-v2, and AMD EPYC™. Additionally, its compatibility with a wide variety of thermal management algorithms, such as Fan Speed Control, PWM Control, and QST Control, make it an ideal choice for high-performance computing.
In conclusion, the ATS-14E-20-C1-R0 is a high-performance heat sink that is perfect for applications that require efficient thermal management and cooling. The fanless design makes it ideal for quiet operation, and the direct attachment manufacturing process makes assembly simpler and less expensive. Additionally, its compatibility with multiple processor architectures and thermal management algorithms make it suitable for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference