| Allicdata Part #: | ATS-14E-28-C3-R0-ND |
| Manufacturer Part#: |
ATS-14E-28-C3-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-14E-28-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.73218 |
| 30 +: | $ 6.35796 |
| 50 +: | $ 5.98387 |
| 100 +: | $ 5.60990 |
| 250 +: | $ 5.23590 |
| 500 +: | $ 4.86191 |
| 1000 +: | $ 4.76841 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal – heat sinks are highly precision industrial components used to dissipate heat from the device it is attached to. The ATS-14E-28-C3-R0 is an efficient heat sink designed for a variety of applications and can be found in most industrial settings.
Heat sinks work by dissipating heat away from the device it is protecting. Heat is transferred from the device into the thermal – heat sink fins, where it is then conducted through the fins and eventually into the surrounding air. Heat sinks are commonly found attached to electronic and industrial components such as transistors, processors, and other types of integrated circuits.
Heat sinks are able to dissipate the heat of the device it is attached to by providing a large surface area, allowing for maximum air contact with the heat sink. The ATS-14E-28-C3-R0 has a large, 28x14x6mm surface area, which provides superior cooling efficiency.
The ATS-14E-28-C3-R0 is designed to be used with a variety of industrial components, from processors to transistors and other integrated circuits. With its robust design, it is capable of dissipating large amounts of heat, and its efficient cooling performance makes it an ideal choice for high-performance applications.
The ATS-14E-28-C3-R0 is available in both natural and conductive finishes, allowing for a variety of applications. The natural finish allows the heat sink to dissipate heat more efficiently, while the conductive finish allows for better heat transfer and fast thermal response. With its highly efficient design, the ATS-14E-28-C3-R0 is ideal for use in high-performance applications where thermal management is essential.
In addition to dissipating heat away from the device, heat sinks are also used to reduce electromagnetic interference (EMI). This is because the fins of the heat sink act as an efficient barrier, shielding the device from outside interference. The ATS-14E-28-C3-R0 is designed with a low-profile design, which minimizes the risk of EMI.
Overall, the ATS-14E-28-C3-R0 is an ideal thermal – heat sink for a variety of applications. With its efficient cooling performance, robust design, and EMI shielding capabilities, the ATS-14E-28-C3-R0 is an excellent choice for industrial and electronic components.
The specific data is subject to PDF, and the above content is for reference